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Internal-layer thick-copper circuit board processing method and internal-layer thick-copper circuit board

A processing method and circuit board technology, applied in the directions of printed circuit components, electrical connection printed components, and printed component electrical connection formation, etc., can solve the problems of inability to use tiny PTH holes, interconnect conduction, etc., and reduce the total copper thickness. , to achieve the effect of dense interconnection in the outer layer and reducing the occupation

Active Publication Date: 2015-09-09
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Embodiments of the present invention provide a processing method for an inner layer thick copper circuit board and an inner layer thick copper circuit board to solve the problem in the prior art that the inner layer thick copper circuit board cannot use tiny PTH holes to achieve interconnection and conduction

Method used

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  • Internal-layer thick-copper circuit board processing method and internal-layer thick-copper circuit board
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  • Internal-layer thick-copper circuit board processing method and internal-layer thick-copper circuit board

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Embodiment 1

[0017] Please refer to figure 1 , an embodiment of the present invention provides a method for processing an inner-layer thick copper circuit board, which may include:

[0018] 110. Process a non-metallized through hole on the thick copper inner layer board, and fill the non-metallized through hole with insulating material.

[0019] Said thick copper inner layer board can be a double-sided copper clad laminate, including an insulating layer in the middle and copper foil layers on both sides, but the copper foil layer is an ultra-thick copper foil, and the thickness of the copper foil layer can be 10 ounces (OZ , 1OZ is approximately equal to 0.035 mm) or 12OZ or even more than 30OZ. In some embodiments, two copper plates can be provided, an insulating adhesive layer is provided between the two copper plates, and then pressed together to obtain a double-sided thick copper-clad thick copper inner layer board. In other embodiments, the thick copper inner layer board may also be...

Embodiment 2

[0036] Please refer to Figure 2g , an embodiment of the present invention provides an inner layer thick copper circuit, which may include:

[0037]At least one inner thick copper wiring layer 24, and at least one metallized through hole 26; the conduction region of the inner thick copper wiring layer 24 penetrated by the metallized through hole 26 has a diameter larger than that of the metallized The buried hole 21 of the through hole 26 , the metallized through hole 26 passes through the buried hole 21 , and the depth of the buried hole 21 is 1OZ to 3OZ smaller than the thickness of the inner thick copper circuit layer 24 .

[0038] Wherein, the thickness of the inner thick copper circuit layer may be greater than or equal to 10OZ.

[0039] The diameter of the buried hole may be 0.2 to 0.5 mm larger than the diameter of the metallized via, and the diameter of the metallized via may be 0.25 to 0.35 mm.

[0040] The inner layer thick copper circuit board provided by the embo...

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Abstract

The invention discloses an internal-layer thick-copper circuit board processing method and an internal-layer thick-copper circuit board so as to solve the problem that, for the internal-layer thick-copper circuit board, interconnection and intercommunication cannot be realized through tiny PTHs in the prior art. The method comprises the following steps: carrying out processing on a thick-copper internal-layer board to form non-plating through holes and filling insulating materials in the non-plating through holes; forming a coating layer, the thickness of which is 1OZ-3OZ, on the surface of the thick-copper internal-layer board; carrying out processing on the surfaces of the thick-copper internal-layer board to form thick-copper circuit patterns; laminating laminated boards on the two surfaces of the thick-copper internal-layer board respectively to enable the non-metalized through holes to become buried holes; carrying out processing on the internal-layer thick-copper circuit board obtained through laminating to obtain plating through holes running through the buried holes and the coating layer, the diameter of each plating through hole being smaller than the diameter of each buried hole; and carrying out processing on the surfaces of the internal-layer thick-copper circuit board to form outer-layer circuit patterns respectively.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a processing method for an inner-layer thick copper circuit board and the inner-layer thick copper circuit board. Background technique [0002] At present, there are more and more circuit board products with ultra-thick copper structure on the inner core board. The general method is that the inner layer uses ultra-thick copper to make high-power module circuits, and the outer layer uses ordinary copper to make control module circuits. The simplest way to conduct between the outer control modules and the conduction between the outer control module and the inner power module is through a metallized through hole (PLATING Through Hole, PTH) with a diameter of 0.25-0.35mm. However, when the inner layer is ultra-thick copper or multi-layer ultra-thick copper, because the total copper thickness is too thick (such as 60-120OZ), it cannot be realized with tiny PTH holes, and only 0...

Claims

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Application Information

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IPC IPC(8): H05K3/40H05K1/11
Inventor 刘宝林
Owner SHENNAN CIRCUITS