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External layer super-thick copper circuit board and boring method thereof

A drilling method and circuit board technology, which is applied to printed circuit parts, electrical connection printed components, and printed component electrical connection formation, etc., can solve the problems of inability to achieve dense interconnection and take up a lot of wiring space, and achieve Dense interconnection and conduction, reducing the effect of wiring space

Active Publication Date: 2015-09-09
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides an outer layer ultra-thick copper circuit board and its drilling method to solve the problem that in the prior art only metallized through holes with a diameter of not less than 0.8mm can be used on the outer layer ultra-thick copper circuit board for interlayer Interconnection, resulting in a large amount of wiring space and the technical problem of being unable to achieve dense interconnection and conduction

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  • External layer super-thick copper circuit board and boring method thereof
  • External layer super-thick copper circuit board and boring method thereof
  • External layer super-thick copper circuit board and boring method thereof

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Embodiment 1

[0025] Please refer to figure 1 , an embodiment of the present invention provides a drilling method for an outer layer ultra-thick copper circuit board, the method may include:

[0026] 110. Provide an outer layer ultra-thick copper circuit board, the outer layer ultra-thick copper circuit board comprising an inner layer board and two outer layers of ultra-thick copper foil layers laminated on both sides of the inner layer board respectively.

[0027] Such as Figure 2a As shown, the outer-layer ultra-thick copper circuit board in the embodiment of the present invention includes: an inner-layer board 20 and two outer-layer ultra-thick copper foil layers 30 pressed on both sides of the inner-layer board 20 respectively. Wherein, said inner layer board 20 is a common copper thick multi-layer board, which may include at least one circuit layer, and the thickness of the circuit layer is generally less than 1 ounce (OZ, 1OZ is approximately equal to 0.035 mm), and at most no more ...

Embodiment 2

[0041] Please refer to Figure 2d , an embodiment of the present invention provides an outer layer ultra-thick copper circuit board, which may include:

[0042] The inner layer board 20 and the two outer layers of ultra-thick copper foil layers 30 pressed on both sides of the inner layer board 20 respectively;

[0043] The two sides of the outer layer ultra-thick copper circuit board have at least one pair of blind holes 40, wherein each pair of two blind holes 40 are respectively located on both sides of the outer layer ultra-thick copper circuit board and the positions are corresponding, located on either side The blind hole runs through the outer super-thick copper foil layer 30 on the surface where it is located;

[0044]The outer super-thick copper circuit board also has at least one through hole 50 , wherein each through hole 50 passes through a pair of blind holes 40 , and the diameter of the through holes 50 is smaller than the diameter of the blind holes 40 .

[004...

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Abstract

The invention discloses an external layer super-thick copper circuit board and a boring method thereof in order to solve the problem in the prior art that the external layer super-thick copper circuit board only adopts a metallizing through hole, the diameter of which is not smaller than 0.8mm, for interlayer interconnection, which causes the problems that the occupied wiring space is too much and the technical problem of the intensive interconnection conduction cannot be achieved. The boring method disclosed by the invention comprises steps of providing an external layer super-thick copper circuit board, wherein the external layer super-thick copper circuit board comprises an inner layer board and two layers of external layer super-thick copper foil layers which are pressed on two sides of the inner layer board, producing at least a pair of blind holes on the external layer super thick copper circuit board, wherein blind holes of each pair are correspondingly positioned on two sides of the external layer super-thick copper circuit board, and the blind holes positioned on any side go through the super-thick copper foil layer of the side, and producing at least one through hole on the external layer super-thick copper circuit board, wherein each through hole passes through a pair of the blind holes and the diameter of the through hole is smaller that of the blind holes.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to an outer-layer ultra-thick copper circuit board and a drilling method thereof. Background technique [0002] For circuit board products with ordinary copper thickness, the simplest way to connect the inner and outer layers is to use a metallized hole (PLATING Through Hole, PTH) with a diameter of 0.25-0.35mm. [0003] In order to facilitate the input of high power, there are more and more circuit board products with super thick copper on the outer layer and normal thick copper on the inner layer. However, because the outer layer of this type of circuit board is ultra-thick copper, the conduction between the power modules on the outer layer and the conduction between the power module on the outer layer and the signal module on the inner layer cannot use 0.25-0.35mm in diameter. To achieve tiny metallized holes, only metallized holes with a diameter of 0.8mm or larger can b...

Claims

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Application Information

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IPC IPC(8): H05K1/11H05K3/42
Inventor 郭长峰刘宝林罗斌
Owner SHENNAN CIRCUITS