Manufacturing method for circuit board capable of detecting inner-layer pore ring

Abstract

The present invention discloses a manufacturing method for a circuit board capable of detecting an inner-layer hole ring and relates to the technical field of production of circuit boards. The manufacturing method comprises: providing a secondary board for pressing and manufacturing the circuit board, wherein the secondary board comprises a PCB unit and a technical edge; manufacturing a circuit pattern in the PCB unit of each secondary board; meanwhile, etching at least two windows at a corresponding position on the technical edge of each secondary board, wherein the diameter of each window is 0.05mm smaller than the outer diameter of a smallest hole ring designed in the PCB unit; pressing each secondary board into the circuit board; drilling a borehole in the PCB unit and drilling an auxiliary hole at the central position of the window on the surface of the technical edge; manufacturing the borehole and the auxiliary hole in the PCB unit into metallized holes; and manufacturing a short-circuit test point of the auxiliary hole. The detection method provided by the present invention can ensure that the inner-layer hole ring of the manufactured circuit board has the diameter that is more than or equal to 0.025mm and meets IPC3 stage standard, is applicable to the circuit board that is particularly indicated that the diameter of the hole ring is required to be controlled to be more than or equal to 0.025mm, so as to effectively avoid complaints resulting from the defect of the inner-layer hole ring and the risk of the whole batch being returned and scrapped due to failure in a sample test.

Description

technical field [0001] The invention belongs to the technical field of circuit board production, in particular to a circuit board manufacturing method capable of detecting inner-layer annular rings. Background technique [0002] During the production process of the printed circuit board, due to the comprehensive factors of the alignment accuracy of the inner layer graphics, the alignment accuracy of the lamination and pre-stacking, and the expansion and contraction of the sub-board after lamination, it is impossible to guarantee that all PCB boards meet the requirements after drilling the sub-board. IPC3 level standard: that is, the hole ring of the metallized hole of each sub-board of the inner layer is ≥0.025mm. In some circuit board applications, it is required that the annular ring in the inner layer of all circuit boards must be ≥ 0.025mm. If 3-5 boards are taken out and sent to a third-party laboratory for slice detection, and the annular ring does not meet the IPC3 st...

AI Technical Summary

Problems solved by technology

[0002] During the production process of the printed circuit board, due to the comprehensive factors of the alignment accuracy of the inner layer graphics, the alignment accuracy of the lamination and pre-stacking, and the expansion and contraction of the sub-board after lamination, it is impossible to guarantee that all PCB boards meet the requirements after drilling the sub-board. IPC3 level standard: that is, the annular ring of the metallized hole of each sub-board in the inner layer is ≥0.025mm

In some circuit board applications, it is required that the annular ring in the inner layer of all circuit boards must be ≥ 0.025mm. If 3-5 boards are taken out and sent to a third-party laboratory for slice detection, and the annular ring does not meet the IPC3 standard, it will be judged as a whole The first batch of circuit boards is defective, so the production of circuit boards that meet the requirements of such standards, if the inner ring is found to be less than 0.025mm when making shipments, will be screened one by one by X-ray detection to pick out those that do not meet the standard requirements Circuit board scrap

However, since X-RAY inspection can only use the naked eye to identify boards with partial holes or serious layers, it is impossible to quantify the size of the inner annular ring of each layer, so it is still possible that the inner annular ring is less than 0.025mm The circuit board flowed into the customer and caused a claim

Images