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Integrated circuit packaging overflow glue removal equipment and method

A technology of integrated circuits and overflowing glue, which is applied in the manufacture of circuits, electrical components, semiconductor/solid-state devices, etc., to achieve the effect of a wide range of applications

Active Publication Date: 2018-01-12
ASE (KUNSHAN) INC
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  • Abstract
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  • Claims
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Problems solved by technology

[0004] Therefore, the existing integrated circuit packaging overflow glue removal technology still needs further improvement

Method used

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  • Integrated circuit packaging overflow glue removal equipment and method
  • Integrated circuit packaging overflow glue removal equipment and method

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Embodiment Construction

[0013] In order to better understand the spirit of the present invention, it will be further described below in conjunction with some preferred embodiments of the present invention.

[0014] figure 1 It is a schematic diagram of the system structure of the integrated circuit packaging end surface glue removal equipment according to an embodiment of the present invention in application.

[0015] Such as figure 1 As shown, the glue removal system 10 according to an embodiment of the present invention includes a feeding mechanism 12 , an integrated circuit packaging glue removal device 14 , a transmission device 16 and a feeding mechanism 18 . The integrated circuit package glue overflow removal device 14 further includes a glue overflow preprocessor 142 , a positioner 144 , a glue overflow remover 146 , and a glue overflow detector 148 . It should be noted that, in other embodiments, the device 14 may not include the post-removal detector 148 . According to an embodiment of t...

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Abstract

The invention relates to an integrated circuit packaging overflow glue removal device and method. According to an embodiment of the present invention, an integrated circuit packaging glue overflow removal device includes: a glue overflow preprocessor, which removes the grease overflow glue on the end face of the integrated circuit package; a locator, which detects and positions the pretreated integrated Residual glue spill on the end face of the circuit package. A spill processor that uses a laser to remove residual glue from end faces of positioned integrated circuit packages. The controller controls the overflow glue processor to remove the residual glue overflow on the end surface of the integrated circuit package. The detector after glue removal is used to detect whether the end face of the integrated circuit package after laser removal of glue is clean. The device and method for removing glue overflow in integrated circuit packaging have better glue overflow cleaning effect and lower cost, and are more in line with the requirements for removing glue overflow on the end face of integrated circuit packaging.

Description

technical field [0001] The present invention generally relates to the field of semiconductors, and more particularly relates to an integrated circuit packaging overflow glue removal device and method. Background technique [0002] In the process of packaging integrated circuits, there is often the problem of glue overflow on the package end surface. There are many reasons for the overflow of glue, such as the deformation of the lead frame causing the overflow of glue and the protrusion of the frame belt causing the overflow of glue and so on. The existence of glue overflow on the end surface of the package will affect the normal use of the integrated circuit package, and if it is serious, it may be scrapped directly and reduce the output of the integrated circuit package. [0003] At present, there are many methods commonly used to remove glue overflow, such as using wet liquid medicine soaking and high-pressure water flushing to remove overflow glue, or using electroplatin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C37/02H01L21/67
Inventor 王明明张建华管有军龚晨剑
Owner ASE (KUNSHAN) INC
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