Device and method for clearing integrated circuit package excessive glue
A technology of integrated circuits and glue overflow, which is applied in the direction of circuit, electrical components, semiconductor/solid-state device manufacturing, etc., to achieve the effect of wide application range
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0013] In order to better understand the spirit of the present invention, it will be further described below in conjunction with some preferred embodiments of the present invention.
[0014] figure 1 It is a schematic diagram of the system structure of an integrated circuit package end face glue spill removal device in application according to an embodiment of the present invention.
[0015] Such as figure 1 As shown, the glue spill removal system 10 according to an embodiment of the present invention includes a feeding mechanism 12, an integrated circuit package glue spill removal device 14, a transmission device 16 and a discharge mechanism 18. The device 14 for removing glue overflow from the integrated circuit package further includes a glue overflow preprocessor 142, a positioner 144, a glue overflow remover 146, and a post glue overflow detector 148. It should be noted that in other embodiments, the integrated circuit package glue overflow removal device 14 may not include th...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2023 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap