Device and method for clearing integrated circuit package excessive glue

Abstract

The invention relates a device and a method for clearing integrated circuit package excessive glue. According to an embodiment of the invention, an integrated circuit package excessive glue clearing device comprises an excessive glue preprocessor, a positioner, an excessive glue processor, a controller and a detector after excessive glue is cleared; the excessive glue preprocessor is used for clearing excessive lipid type excessive glue on the end face of the integrated circuit package; the positioner is used for detecting and positioning residual excessive glue on the end face of the preprocessed integrated circuit package; the excessive glue preprocessor is used for clearing the residual excessive glue on the end face of the positioned integrated circuit package by using laser, the controller is used for controlling the excessive glue preprocessor to clear the residual excessive glue of the end face of the integrated circuit package; the detector after excessive glue is cleared is used for detecting that the end face of the integrated circuit package of which the excessive glue is cleared by the laser is clean or not. The device and the method for clearing integrated circuit package excessive glue have a better excessive glue clearing effect, and the cost is lower, and the device and the method are more conform to the requirement of excessive glue clearing on the end face of integrated circuit package.

Description

technical field [0001] The present invention generally relates to the field of semiconductors, and more particularly relates to an integrated circuit packaging overflow glue removal device and method. Background technique [0002] In the process of packaging integrated circuits, there is often the problem of glue overflow on the package end surface. There are many reasons for the overflow of glue, such as the deformation of the lead frame causing the overflow of glue and the protrusion of the frame belt causing the overflow of glue and so on. The existence of glue overflow on the end surface of the package will affect the normal use of the integrated circuit package, and if it is serious, it may be scrapped directly and reduce the output of the integrated circuit package. [0003] At present, there are many methods commonly used to remove glue overflow, such as using wet liquid medicine soaking and high-pressure water flushing to remove overflow glue, or using electroplatin...

AI Technical Summary

Problems solved by technology

[0004] Therefore, the existing integrated circuit packaging overflow glue removal technology still needs further improvement

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