Excessive glue full automatic production line of semiconductor lead frame

Abstract

The invention discloses an excessive glue full automatic production line of a semiconductor lead frame. The production line comprises the following steps of continuous and automatic loading, chemical treatment solution soaking, air exhaustion, electrolytic excessive glue removal, water washing, soaking and automatic unloading, reversing and high pressure water knife spraying. An automatic loading and unloading mechanism is mainly driven pneumatically; a transmission mechanism is a chain transmission mechanism; and a discharged material strip after being soaked directly enters the high pressure water knife system. The excessive glue full automatic production line of the semiconductor lead frame, disclosed by the invention, has the advantages of compact equipment, small space usage, stability in operation, convenience for maintenance, reliable process, good quality of the treated product, high efficiency, large treatment quantity, medicine liquor conservation, water and electricity conservation, environment friendliness, substantially no damage to human body from hot air and medicine liquor smell; and the field operation environment is largely improved. Glue removing liquors with different performances and operation temperatures can be adopted by using multiple parallel soaking grooves; and electrolytic excessive glue removal can be also combined to realize optimal excessive glue removing effect. By using a reversing turntable, the high pressure water knife can be arranged in parallel with the soaking system so that space usage is saved and convenience in operation is obtained.

Description

technical field [0001] The invention belongs to the technical field of electroplating pretreatment, and in particular relates to a full-automatic production line for removing overflowing glue from semiconductor lead frame packaging. Background technique [0002] After the semiconductor lead frame is epoxy-encapsulated, there will be overflow glue remaining on the lead pin and the heat sink, which needs to be removed before the subsequent tin plating. The methods of removing overflow glue are mainly chemical solution immersion method (Chemical Deflush), electrolysis method (Electrolisis Deflush) and mechanical method (Michenical Deflush). Mechanical methods are now rarely used because the blasting media used can damage the substrate. The electrolysis method is greatly limited because the electrolysis voltage or current is too high to damage the chip and cause delamination, and it cannot remove some serious overflow glue. The chemical solution immersion method dissolves or s...

AI Technical Summary

Problems solved by technology

The whole process is complicated to operate and consumes a lot of physical strength. During the treatment process, the high temperature, the smell of the liquid medicine, and the liquid medicine and washing water in the soaking tank and the washing tank are brought out or overflowed, causing the site to be full of water, and the operating environment is extremely poor, which also increases the Liquid loss and wastewater volume

In recent years, although the cantilever driving method like the semi-automatic hanging plating line has been used to improve the hoisting and input of the material box, which saves manual labor to a certain extent, the long soaking time and short washing time of the process have not actually improved. Many, the efficiency is basically not improved, the liquid medicine is brought out and the amount of waste water is basically unchanged, and after soaking, it has to be manually processed on the high-pressure water jet equipment one by one

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