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A kind of LED light-emitting device and preparation method thereof

A technology of light-emitting devices and LED chips, which is applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as low light efficiency and color rendering index, increase high refractive index, and affect light-emitting performance, so as to improve light efficiency and reduce Light refraction, the effect of improving the light output rate

Active Publication Date: 2018-09-18
SICHUAN SUNFOR LIGHT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the technical solutions provided by the above two patents improve the light efficiency and uniformity to a certain extent, since different types of phosphors are prepared separately, the total reflection from high refractive index to low refractive index will be increased, which will affect the luminous performance. The efficiency and color rendering index are not high, and the process is complicated and difficult to produce

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  • A kind of LED light-emitting device and preparation method thereof
  • A kind of LED light-emitting device and preparation method thereof
  • A kind of LED light-emitting device and preparation method thereof

Examples

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preparation example Construction

[0098] A method for preparing an LED light-emitting device, characterized in that it comprises the following steps:

[0099] (1) Fixing the LED chip on the substrate;

[0100] (2) The refractive index buffer layer formed by uniformly mixing the fine powder filler with the refractive index between the LED chip and the silica gel and the silica gel is arranged on the LED chip in an adhesive manner;

[0101] (3) A resin layer is provided on the refractive index buffer layer.

[0102] According to a preferred specific embodiment, the above-mentioned preparation method further includes the following steps: (4) disposing a non-uniform luminescent powder layer on or within the resin layer in which the phosphor powder is non-uniformly distributed. The non-uniform luminescent powder layer 105 includes at least two layers of luminescent powder layered on top of each other and composed of phosphor powders of different types, or at least two layers of luminescent powder layered on top of...

Embodiment 1

[0104] Embodiment 1: the preparation of refractive index buffer layer

[0105] The preparation method of the refractive index buffer layer is to obtain the refractive index buffer layer by uniformly mixing 0.01% to 50% by weight of powdered filler with silica gel, or simply by filling the groove on the substrate for fixing the LED chip with powder The refractive index buffer layer is obtained by using the filling material. The light transmittance of the powder filler is greater than 50%, the refractive index is in the range of 1.05-2.5, and the particle size is in the range of 0.1 μm-200 μm. Powdered fillers are glass beads, fused quartz, fluorite and / or crown glass. See Table 3 for the refractive index of the above materials and the mixing ratio with silica gel.

[0106] table 3

[0107] substance

Refractive index

The mixing ratio(%)

Fused Quartz

1.45843

5

fluorite

1.43381

15

crown glass

1.51110～1.51630

10

[01...

Embodiment 2

[0115] Example 2: Non-uniform luminescent powder film prepared using the principle of free sedimentation

[0116] Using the principle of sedimentation, phosphors with different specific gravity have different sedimentation speeds in silica gel. Since the silica gel has a certain viscosity, the phosphor is subjected to gravity and the buoyancy of the silica gel in the silica gel, and the phosphor particles have a downward acceleration under the action of the two forces. Since the luminescent film has a certain thickness, the settling time of the fluorescent powder in the silica gel can be estimated.

[0117] Referring to Figure 3(a) and Figure 3(b), circles of different sizes represent phosphors of different particle sizes. It should be noted here that the particle size of the phosphor is a continuously changing value, even for the same phosphor particle size They are not the same, but there is a division. According to the statistical point of view, we take the middle value, s...

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Abstract

The invention relates to an LED light-emitting device and a preparation method thereof. The device comprises a substrate, an LED chip and an organic layer arranged on the substrate. It is characterized in that a refractive index buffer layer with a refractive index between the LED chip and silica gel is provided between the LED chip and the organic layer, and the refractive index buffer layer guides the light emitted by the LED chip into the The organic layer allows more light to pass through the organic layer. The organic layer is covered with a non-uniform luminescent powder layer, and the non-uniform luminescent powder layer includes at least two different types of luminescent powder layers arranged in layers or luminescent powder layers of the same type with different particle sizes. Phosphor powders of the same type or particle size in the layer are uniformly arranged, and phosphor powders of different types or particle sizes are relatively non-uniformly arranged.

Description

technical field [0001] The invention relates to an LED light-emitting device and a preparation method thereof, belonging to the field of solid-state lighting. Background technique [0002] LED light source has the advantages of energy saving, durability, and no pollution. It has been widely used in lighting, display, and backlight. As a next-generation lighting method with clear advantages, it has attracted widespread attention. [0003] Based on the characteristics of long life, high efficiency and high light utilization rate of LED, LED lighting has been widely used in daily lighting. However, many technical problems have been encountered during the use process, so many people have also done a lot of research and improvement on the LED packaging method. At this stage, the LED white light source mostly adopts the traditional dispensing packaging process. In this process, phosphor powder and glue are easy to settle after mixing and close to the chip. This leads to shortene...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/50H01L33/64
Inventor 王森赵昆王莉黄德忠张强
Owner SICHUAN SUNFOR LIGHT
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