Ultra-thin even-temperature plate device and manufacturing method thereof

Abstract

The invention provides an ultra-thin even-temperature plate device and a manufacturing method thereof. The device comprises a bottom plate, a capillary core, an upper cover plate and a working medium. A gas-liquid channel integrated design is adopted in the capillary core, a steam circulation space and a liquid backflow channel are arranged on the capillary core in the plane direction, and a solid part of the capillary core is provided with holes for supporting columns to penetrate, the supporting columns are arranged on the bottom plate, the bottom plate is of a groove structure, and the supporting columns are evenly arranged in the bottom plate. The supporting columns penetrate the holes to make contact with the inner surface of the upper cover plate, and welding forming is finished. A liquid filling port is reserved in the bottom plate, and after filling of the working medium, sealing welding is carried out. The manufacturing method of the device comprises the steps of machining of the bottom plate and the upper cover plate, punching forming of the capillary core, vacuum pressurizing diffusion welding, machining margin removing, vacuumizing liquid injecting and the sealing welding process. An even-temperature plate can be manufactured to be of an ultra-thin structure, and the ultra-thin even-temperature plate device and the manufacturing method are particularly suitable for heat dissipation occasions with the strict requirement for the installing thickness space.

Description

technical field [0001] The invention belongs to the field of thermal control of spacecraft, and relates to a vapor chamber, in particular to an ultra-thin vapor chamber device and a manufacturing method thereof. Background technique [0002] In the field of spacecraft thermal control, the sharp increase in the heat flux density of various stand-alone electronic chips and the decreasing effective heat dissipation space make ultra-thin heat pipe heat dissipation components ideal heat conduction components in this application background. For example, in the heat dissipation problem of phased array radar, the heating elements of the T / R components that need to be arrayed need to be quickly uniformed and heat transfer. The array spacing is getting smaller and smaller as the radar power continues to increase. At present, the common component spacing is 2mm Left and right, how to take advantage of the limited thickness space to quickly and uniformly heat the phased array radar T / R ...

AI Technical Summary

Problems solved by technology

The vapor chamber of this structure mainly consists of the upper and lower capillary cores and the cavity area in the middle of the capillary core to form the liquid return channel and the steam circulation space respectively. Due to the existence of the steam channel in the thickness direction, it is difficult to reduce the height of the cavity.

Restricted by this structural form and processing method, the average thickness of this type of mainstream structure is generally above 3-6mm, and it is difficult to achieve a thickness of 1-2mm.

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