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Receiving mechanism for dispensing machine and dispensing machine

A technology of receiving mechanism and dispensing machine, which is applied in the mechanical field and can solve the problems of flying out, danger, waste of labor, etc.

Active Publication Date: 2016-03-23
苏州高新区华成电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the prior art, the invention patent with the application number "201320267091.6" discloses a glue dispenser for diodes, which prevents it from being polluted by the outside by dispensing glue on the PN junction on the diode, but this kind of glue dispensing During the production process of the machine, the diodes are transported by using a fixed plate loaded with diodes, but the operator must collect the fixed plate at the other end of the dispenser, which is a waste of labor. At the same time, if the operator does not block the dispensing The track groove of the machine, the diode fixing plate will fly out directly, which is very dangerous

Method used

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  • Receiving mechanism for dispensing machine and dispensing machine
  • Receiving mechanism for dispensing machine and dispensing machine
  • Receiving mechanism for dispensing machine and dispensing machine

Examples

Experimental program
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Effect test

Embodiment Construction

[0025] refer to Figure 1 to Figure 7 Embodiments of the present invention will be further described.

[0026] Such as figure 1 and image 3 As shown, a dispensing machine O receiving mechanism includes a frame 1, and the frame 1 includes a receiving tray 12, a feed port 11, a board arrangement device 14 and a detection device 13, and the receiving tray 12 is arranged on the frame 1 Above, the receiving tray 12 can be used to accommodate the diode fixing plate 02; the feed inlet 11 is respectively arranged at the corresponding positions of the frame 1 and the receiving tray 12, and the receiving tray 12 is provided with a handle for lifting in the present invention, and at the same time The feeding port 11 is arranged on the side of the receiving tray 12, and the feeding port 11 is set through the entire receiving tray 12, and the receiving tray 12 is used to receive the diode fixing plate 02 from the material path of the dispenser 0; the plate arrangement device 14, which ...

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PUM

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Abstract

The invention discloses a receiving mechanism for a dispensing machine and the dispensing machine. According to the technical scheme, the receiving mechanism for the dispensing machine is characterized by comprising a rack, and the rack comprises a receiving disc, feeding openings, a plate arranging device and a detection device; the receiving disc is arranged on the rack and used for containing diode fixing plates; the feeding openings are formed in the corresponding positions of the rack and the receiving disc and used for receiving the diode fixing plates on a material way of the dispensing machine; the plate arranging device is arranged on the rack and used for conveying the diode fixing plates into the receiving disc in sequence; and the detection device is used for detecting the number of the diode fixing plates in the receiving disc and controlling the dispensing machine to stop acting. The plate arranging device is arranged and used for conveying the diode fixing plates into the receiving disc in sequence, so that the diode fixing plates can be conveyed into the receiving disc from the feeding openings in sequence, and automatic receiving is finished.

Description

technical field [0001] The invention relates to the field of machinery, more specifically, it relates to a material receiving mechanism of a glue dispenser and a glue dispenser. Background technique [0002] With the continuous development of science and technology, the electrical equipment used by people has risen. In the field of electrical appliances, semiconductors are a common electrical component. It plays an important role in many circuits. For example, in the metallurgical industry, chemical production , Power engineering, paper industry. [0003] Diode is a kind of semiconductor material, its core is PN junction, which has the characteristics of forward conduction, reverse cut-off, breakdown, good shock resistance, low power consumption, and low cost. [0004] In the prior art, the invention patent with the application number "201320267091.6" discloses a glue dispenser for diodes, which prevents it from being polluted by the outside by dispensing glue on the PN jun...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C13/02
Inventor 叶惠东
Owner 苏州高新区华成电子有限公司
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