Manufacturing method of circuit board, circuit board and drill needle
A production method and circuit board technology, which is applied in the manufacture of printed circuits, printed circuits, electrical components, etc., can solve the problems that affect the service life of drill needles, such as back-drilling quality pass rate, and achieve the effects of ensuring service life and reducing production costs
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Embodiment 1
[0045] Figure 2 to Figure 6 The specific process of the manufacturing method of the circuit board provided by a specific embodiment of the present invention is shown. The following will combine Figure 2 to Figure 6 Describe in detail how to make circuit boards.
[0046] A method for manufacturing a circuit board, specifically comprising:
[0047] S1: A hydrophobic film 2 is formed on the outer wall above the tip of the drill 1, such as figure 2 shown;
[0048] S2: Use figure 2 The shown drill pin 1 coated with the hydrophobic film 2 drills through holes in the circuit substrate 6, as image 3 As shown, the inner wall of the drilled through hole 3 includes a first inner wall part and a second inner wall part connected to each other, and the hydrophobic film 2 remains on the first inner wall part to form a hydrophobic film residual layer 4, as Figure 4 Shown; Hydrophobic membrane 2 refers to the membrane material that contains hydrophobic groups, so hydrophobic membra...
Embodiment 2
[0067] Such as Figure 6 As shown, this embodiment provides a circuit board, including a circuit substrate, a through hole 3 in the circuit substrate, and a conductive layer 5 on the inner wall of one side of the through hole 3 .
[0068] It should be noted that this kind of circuit board can be prepared by any one of the implementation methods described in Example 1, and can also be prepared by other preparation methods. When it is prepared by using any one of the embodiments described in Example 1, it has various advantages described in Example 1.
Embodiment 3
[0070] Such as figure 2 As shown, the present embodiment provides a drill, which includes a drill body, the drill body has a tip, and a hydrophobic film 2 coated on the outer wall of the drill body away from the tip.
[0071] As a preferred embodiment, the material of the hydrophobic membrane 2 is grease, polytetrafluoroethylene, polypropylene or polyvinylidene fluoride.
[0072] As a preferred embodiment, the thickness of the hydrophobic membrane 2 is 10-50 μm, for example: 10 μm, 20 μm, 50 μm, etc. The thickness of the hydrophobic membrane 2 can be selected within the above range according to actual needs.
[0073] As a preferred embodiment, the diameter of the drill 1 is 0.1-0.8 mm, for example: 0.1 mm, 0.5 mm, 0.8 mm, etc., and the diameter of the drill 1 can be selected according to the size of the through hole to be formed later.
[0074] The above-mentioned drill 1 can be used in the manufacturing method of the circuit board described in Embodiment 1, and can also be ...
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