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Early ripening maize high-yield cultivation technology

A kind of corn technology, applied in the field of agriculture, can solve the problems of not full grains, slow filling, etc., and achieve the effect of good ear grain properties, thick cuticle, and less bract leaves

Inactive Publication Date: 2016-04-20
李威
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although early-maturing corn has the above-mentioned advantages, the disadvantages of early-maturing corn are also very obvious, such as slow filling and prone to grains not being full

Method used

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Embodiment Construction

[0014] The high-yield cultivation technique for early-maturing corn is characterized in that it comprises the following steps.

[0015] 1. Seed treatment, selected seeds. Seed coating: Use seed coating agent to prevent pests and diseases. Use 100kg of seeds with 100-150ml of 6% tebuconazole, or 400ml of 3% dividan, or 200g of Ruisheng + 100ml of Manshijin, or 400ml of 20% carbofuran to control silk smut respectively disease, tumor smut, seedling wilt and viral diseases, seedling pests. The above-mentioned medicines can be selected from suitable compatible species, mixed with coating, so as to achieve the effect of concurrent prevention.

[0016] 2. Sowing and seedling preservation: (1) Ensure the bottom moisture and sow with proper moisture. Appropriate early sowing, sowing can be done when the ground temperature of 5-10cm is stable and exceeds 8°C, so as to prevent too late sowing. (2) Appropriate deep sowing, the depth of trenching is not less than 10cm, the depth of cov...

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PUM

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Abstract

The invention provides an early ripening maize high-yield cultivation technology, belongs to the field of agriculture, and especially relates to a maize cultivation technology. The invention provides the early ripening maize high-yield cultivation technology which is fast in grouting and full in particles. The early ripening maize high-yield cultivation technology is characterized by comprising the following steps: 1, processing seeds and selecting seeds, pelleting seeds, using a seed coating to coat, to prevent and control pest and disease damages; 2, sowing and conserving seedlings: (1) ensuring soil moisture and sowing in proper moisture in soil, appropriately sowing early, on 5-10 cm land, when ground temperature being constant at 8 DEG C, sowing, to prevent sowing too late; 3, applying fertilizer and irrigating, according to target yield and foil fertility, determining fertilizer and water safeguard measures, to strictly guard against drought, especially paying attention to moisture supply in a critical period; 4, controlling pests and diseases later, in a belltop stage, using 10 ml chlorantraniliprole.thiamethoxam, 15 ml Ainong, and 30 kg water in each mu, spraying on stem leaves, to prevent European corn borers, oriental armyworms, aphids, and leaf spot diseases, rust disease, and gall smut, etc.

Description

technical field [0001] The invention belongs to the field of agriculture, and in particular relates to a corn cultivation technique. Background technique [0002] Early-maturing corn has a growth period of 111 days and requires an effective accumulated temperature of 2120°C. It is known for its early maturity, dense planting, and high yield. In March 2005, it passed the approval and promotion of Heilongjiang Crop Variety Approval Committee. The seedlings have strong soil arching ability, fast seedling emergence, low temperature resistance, and dark green leaves. The plant type is convergent, the internodes on the ears are long, the group is well ventilated and light-transmitting, the aerial roots are well developed, and the stalks have strong lodging resistance, so they are suitable for dense planting. The height of the adult plant is 237cm, the ear height is 93cm, the number of leaves is 18 pieces, the ear is nearly cylindrical, the ear length is 19.5cm, the ear diameter ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A01G1/00A01C1/06
Inventor 李威
Owner 李威
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