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Cooling system of server and server

A cooling system and server technology, applied in the server field, can solve problems such as CPU temperature rise, poor heat dissipation, and refrigerant drying, and achieve the effect of ensuring safety and avoiding poor heat dissipation.

Active Publication Date: 2016-04-20
SUGON DATAENERGYBEIJING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

The blades allocated with less refrigerant may have poor heat dissipation, and even cause the refrigerant to burn out, which will cause the CPU temperature to rise sharply and cause CPU damage

Method used

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  • Cooling system of server and server
  • Cooling system of server and server

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Embodiment Construction

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention.

[0038] According to an embodiment of the present invention, a cooling system for a server is provided.

[0039] Such as figure 1 As shown, the heat dissipation system of the server according to the embodiment of the present invention includes:

[0040] Multiple liquid cooling devices, each liquid cooling device is in close contact with the heating element of the server and contains cooling liquid;

[0041] A cooling device, used for cooling the imported cooling liquid;

[0042] The liquid ...

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Abstract

The invention provides a cooling system of a server and the server. The system comprises a plurality of liquid cooling devices, a cooling device and a liquid distribution device. Each liquid cooling device makes contact with heating elements of the server and contains cooling liquid. The cooling device is used for cooling led-in cooling liquid. A parallel-connection resistance device is arranged in the liquid distribution device. The liquid distribution device is connected with the liquid cooling devices and the cooling device and used for leading the cooling liquid of the liquid cooling devices into the cooling device and evenly distributing the cooled cooing liquid in the cooling device into each liquid cooling device. The cooled cooling liquid can be evenly distributed into each liquid cooling device through the liquid distribution device connected with the liquid cooling devices and the cooling device, and therefore the disadvantage that because liquid distribution is not even, cooling is poor when the server is cooled by liquid is avoided, and safety of the server is ensured.

Description

technical field [0001] The present invention relates to the field of servers, in particular to a cooling system for a server and the server. Background technique [0002] Most of the computers currently in use rely on cold air to cool down the machine, but in data centers, air cooling alone is not enough to meet the heat dissipation requirements of high heat flux density servers. The traditional air-cooling mode adopts the indirect contact cooling method. The heat transfer process is complicated, and there are contact thermal resistance and convective heat transfer thermal resistance. The total thermal resistance is large, and the heat transfer efficiency is low. The large temperature difference requires a lower outdoor low-temperature heat source to guide the heat exchange process. [0003] Therefore, in order to meet the heat dissipation requirements of the server, in the prior art, water cooling or liquid cooling is usually used to dissipate heat for the server. Water c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/201
Inventor 王晨
Owner SUGON DATAENERGYBEIJING CO LTD
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