A thin self-control protector and its manufacturing method
A technology of self-control and protector, which is applied in the direction of automatic disconnection emergency protection device, emergency protection circuit device, and protection reacting to overcurrent, etc., and can solve problems such as overcurrent and overtemperature protection that are not suitable for super large current circuits , to achieve the effect of high flow resistance, broad application prospects and small size
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0056] Such as figure 1 It is the structural representation in embodiment 1, figure 2 It is the schematic sectional view in embodiment 1 and image 3 It is shown in the circuit schematic diagram in embodiment 1:
[0057] A thin self-control protector, comprising a ceramic substrate 1 and a conductive electrode, the ceramic substrate 1 is provided with a conductive hole, the front and the back of the ceramic substrate 1 are provided with conductive electrodes, between the front and the back conductive electrodes Connecting electrodes 5 are arranged vertically, and a main conductive loop 4 is connected to the conductive electrodes to form a loop, wherein:
[0058] Such as figure 1 As shown, the ceramic substrate 1 is a rectangle, and grooves 11a, 11b, 11c, 11d are provided at the middle positions a, b, c, and d of the four sides of the ceramic substrate 1; The upper and lower surfaces of the ceramic substrate 1 are located at the positions of the grooves, respectively provi...
Embodiment 2
[0083] Such as Figure 4 It is a schematic structural diagram of PTC used in Example 2 (without upper cover), Figure 5 It is the PTC structure schematic diagram used in embodiment 2 and Figure 6 As shown in the circuit diagram using PTC in embodiment 2, this embodiment is the same as embodiment 1 except that the material of the main conductive circuit 4 is PPTC (polymer-based PTC), and the printing process of the ceramic substrate 1' is the same as that of embodiment 1.
[0084] After the printing process of the ceramic substrate 1' is completed, the chip PPTC made by the traditional process is welded with the first conductive electrode 21' on the front and the third conductive electrode 23' on the front by reflow soldering or manual welding to form a dominant Electrical circuit 4, such as Figure 4 shown.
[0085] Finally, the upper cover 14' is installed on the ceramic substrate 1', and cured with glue, and the curing condition is (120°C, 30min).
[0086] The design of...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com



