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A thin self-control protector and its manufacturing method

A technology of self-control and protector, which is applied in the direction of automatic disconnection emergency protection device, emergency protection circuit device, and protection reacting to overcurrent, etc., and can solve problems such as overcurrent and overtemperature protection that are not suitable for super large current circuits , to achieve the effect of high flow resistance, broad application prospects and small size

Active Publication Date: 2019-02-15
SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the above-mentioned devices are not suitable for over-current and over-temperature protection of super-high current circuits.

Method used

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  • A thin self-control protector and its manufacturing method
  • A thin self-control protector and its manufacturing method
  • A thin self-control protector and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] Such as figure 1 It is the structural representation in embodiment 1, figure 2 It is the schematic sectional view in embodiment 1 and image 3 It is shown in the circuit schematic diagram in embodiment 1:

[0057] A thin self-control protector, comprising a ceramic substrate 1 and a conductive electrode, the ceramic substrate 1 is provided with a conductive hole, the front and the back of the ceramic substrate 1 are provided with conductive electrodes, between the front and the back conductive electrodes Connecting electrodes 5 are arranged vertically, and a main conductive loop 4 is connected to the conductive electrodes to form a loop, wherein:

[0058] Such as figure 1 As shown, the ceramic substrate 1 is a rectangle, and grooves 11a, 11b, 11c, 11d are provided at the middle positions a, b, c, and d of the four sides of the ceramic substrate 1; The upper and lower surfaces of the ceramic substrate 1 are located at the positions of the grooves, respectively provi...

Embodiment 2

[0083] Such as Figure 4 It is a schematic structural diagram of PTC used in Example 2 (without upper cover), Figure 5 It is the PTC structure schematic diagram used in embodiment 2 and Figure 6 As shown in the circuit diagram using PTC in embodiment 2, this embodiment is the same as embodiment 1 except that the material of the main conductive circuit 4 is PPTC (polymer-based PTC), and the printing process of the ceramic substrate 1' is the same as that of embodiment 1.

[0084] After the printing process of the ceramic substrate 1' is completed, the chip PPTC made by the traditional process is welded with the first conductive electrode 21' on the front and the third conductive electrode 23' on the front by reflow soldering or manual welding to form a dominant Electrical circuit 4, such as Figure 4 shown.

[0085] Finally, the upper cover 14' is installed on the ceramic substrate 1', and cured with glue, and the curing condition is (120°C, 30min).

[0086] The design of...

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Abstract

The invention relates to a thin type self-control protector and a manufacturing method thereof. The thin type self-control protector at least comprises a ceramic substrate and conductive electrodes. The ceramic substrate is provided with conductive holes. The front surface and the back surface of the ceramic substrate are provided with the conductive electrodes. Connecting electrodes are perpendicularly arranged between the conductive electrodes of the front surface and the back surface. A main conductive loop is connected on the conductive electrodes so as to form a loop. The ceramic substrate is rectangular, and the middle positions of the four sides of the ceramic substrate are respectively provided with a slot. The positions, which are arranged at the slot positions, of the upper and lower surfaces of the ceramic substrate are respectively provided with front first, second, third and fourth conductive electrodes and back first, second, third and fourth conductive electrodes which are corresponding to the front positions. A heating layer is arranged on the two nonadjacent front conductive electrodes. An insulating layer is arranged on the heating layer. An electrode layer is arranged on the insulating layer. The electrode layer connects another two nonadjacent front conductive electrodes and then is connect with the main conductive loop so as to form back electricity.

Description

technical field [0001] The invention relates to a self-control protection element for electronic products, in particular to a thin self-control protector mainly used in portable electronic products such as mobile phones, notebook computers, and tablet computers and a manufacturing method thereof. Background technique [0002] In recent years, the electronics industry has developed rapidly, especially the development of computer technology and communication technology. [0003] Computers are developing toward personalization and miniaturization. More and more ultra-thin and ultra-small notebook computers and tablet computers are coming out. The battery capacity is increasing, and the requirements for electronic components are getting higher and higher. [0004] Communication technology is developing in the direction of bandwidth and personalization. Nowadays, various smart phones emerge in an endless stream, with various functions, screens are getting bigger and bigger, and t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02H3/08H02H3/06
Inventor 钱朝勇杨彬张子川
Owner SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO LTD
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