A kind of reverse conduction type MOS gate-controlled thyristor and its manufacturing method
A technology of thyristor and reverse conduction, which is applied in the direction of thyristor, semiconductor/solid-state device manufacturing, semiconductor devices, etc., can solve problems such as adverse effects of forward conduction, voltage stagnation, and device damage, and achieve the suppression of snapback effect and large current conduction ability, the effect of reducing cell length
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[0033] Below in conjunction with accompanying drawing, describe technical scheme of the present invention in detail:
[0034] figure 2 It is a structural schematic diagram of a reverse conduction type MOS gate-controlled thyristor of the present invention. As shown in the figure, it includes metallized cathode 1, gate electrode 2, gate oxide layer 3, P well 4, N well 5, P well 6, N drift region 7, P floating layer 8, N anode region 9, and P anode Region 10, metallized anode 11 and anode isolation oxide layer 12; P well 6 is located on top of N drift region 7, N well 5 is located in P well 6, P well 4 is located in N well 5, gate oxide layer 3 is located in N well 5 , the surfaces of the P well 6 and the N drift region 7, the gate electrode 2 is located on the surface of the gate oxide layer 3, and the metallized cathode 1 covers the N well 5, the P well 6 and a part of the P well 4. The lower surface of the N drift region 7 has a P floating region 8, between the P floating ...
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