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Enhanced IC card

A technology for integrated circuit cards and segments, applied in the field of integrated circuit cards, can solve problems such as expensive and unsolved, and achieve the effect of preventing the formation of sawtooth edges

Active Publication Date: 2016-11-09
STMICROELECTRONICS SRL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this technique is even more expensive due to the molding process and does not address the above-mentioned problems associated with pre-cut wires

Method used

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  • Enhanced IC card
  • Enhanced IC card
  • Enhanced IC card

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0055] refer to figure 2 , which shows in schematic form an integrated circuit card 1 according to the invention comprising a substrate 2 and a circuit 3 integrated in the substrate. The substrate is of a size and form equivalent to format 1FF, and the card may for example be used for banking type applications, for example as a credit card or ATM card.

[0056] The electrical pads or contacts of the circuit 3 intended to come into contact with the reader are substantially coplanar with the surface S of the substrate 2 and are exposed on the card. The first zone defines a first section 5 of the substrate 2 comprising the circuit 3 , the first section 5 being delimited by a first pre-cut or weakened line 4 .

[0057] The first section 5 can be detached from the card 1 . In particular, the first section 5 has the form and size equivalent to an integrated circuit card in 4FF format and can be used for specific applications, for example in the iPhone5. Once the first section 5 ...

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PUM

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Abstract

An integrated-circuit card (1) is described, said card comprising a substrate (2) and a circuit (3) integrated in the substrate (2), with the pads of the circuit (3) substantially coplanar with a surface (S) of the substrate (2). The substrate (2) comprises a first area defining a first sector (5) comprising the circuit (3) and able to be separated from the card (1), said first sector (5) having a form and size equivalent to a 4FF format of integrated-circuit cards and being intended to be separated from the card owing to a first pre-cut or weakening line (4) delimiting said first sector (5) with 4FF format; the card further comprises at least one area defining a second sector (7) around the first sector (5) and able to be separated from card (1) owing to a second pre-cut or weakening line (6), said second sector (7) having a form or size equivalent to a 2FF or 3FF format of integrated-circuit cards, and a screen-printed coating (8) on the surface (SC) opposite to the surface (S) of the substrate (2), in the region of at least the second sector (7), the screen-printed coating (8) having, along the second sector (7), a thickness (B) which is equal to the difference between a predefined thickness (X) of the 2FF or 3FF format and a thickness (A) of the first sector ( 5 ).

Description

technical field [0001] The present invention relates to an integrated circuit card comprising a substrate and a circuit integrated in the substrate from which the circuit can be detached together with a section of the substrate having a form and size equivalent to a predetermined 2FF, 3FF or 4FF format. [0002] The invention also relates to a method of manufacturing an integrated circuit card of the type described above. Background technique [0003] Integrated circuit cards comprising a substrate and circuits integrated in the substrate are known. [0004] substrate (for example with figure 1 The substrate 20) and the circuit 3 shown in the predetermined 1FF format can be used as a card for certain applications conforming to the standard ISO / IEC 7810:2003, eg as a credit card or ATM card. [0005] For other applications, the circuit is of a predetermined form and size (e.g. equivalent to 2FF, 3FF or 4FF format ( figure 1 ) of predetermined form and size) are detached fr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077
CPCG06K19/0772G06K19/07739H01L21/56
Inventor G·费尔皮A·赛斯蒙多R·凯阿兹佐
Owner STMICROELECTRONICS SRL