A fitting mechanism and equipment
A technology of lamination area and positioning mechanism, applied in the field of machinery, can solve the problems of low lamination efficiency, lamination accuracy and lamination efficiency, and lamination error, and achieve integrated optimization, improve production efficiency, and system control. and the effect of assembly process optimization
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[0016] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0017] see figure 1 , is a structural schematic diagram of an embodiment of the bonding mechanism of the present invention. The bonding mechanism can be used in the production of related modules that need to be bonded, and is especially applicable to the bonding of fingerprint recognition modules. The bonding mechanism includes a three-dimensional driving mechanism 45, a cover plate suction head 41, a bonding area 44, a metal shell positioning mechanism 42 and a cover plate positioning mechanism 43, wherein the cover plate suction head 41 is installed on the three-dimensional driving mechanism 45, and is sucked with the cover plate. The area opposite to the head 41 is provided with a bonding area 44. After the metal shell positioning mechanism 42 identifies and positions the metal shell workpiece on the bonding area 44, the three-dimensional driving me...
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