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Substrate structure

A technology of substrates and conductive bumps, which is applied to semiconductor/solid-state device components, semiconductor devices, electrical components, etc., and can solve problems such as non-coplanar requirements and reliability issues

Active Publication Date: 2019-03-12
SILICONWARE PRECISION IND CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, because the width R of the first conductive bump 11 is different from the width W of the second conductive bump 12, the first and second pre-tin-silver layers 111, 121 with the same thickness will cause the first The height L' of the conductive bump 11 is inconsistent with the height L" of the second conductive bump 12, and the height difference between the two is greater than 8um, so it does not meet the requirement of coplanarity, such as Figure 1B As shown, the height L" of the second conductive bump 12 is smaller than the height L' of the first conductive bump 11, which will cause reliability problems in the connection between the package substrate 1 and the chip.

Method used

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Embodiment Construction

[0037] The implementation of the present invention is described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0038] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for the understanding and reading of those familiar with this technology, and are not used to limit the implementation of the present invention Therefore, it has no technical substantive meaning. Any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of this invention without affecting the effect and purpose of the present invention. The technical content disclosed by the invention must be within the scope covered. At the same time, terms such as "above", "first",...

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Abstract

Provided is a substrate structure, including a substrate body formed with a plurality of electrical contact pads; first and second conductive bumps formed on the electrical contact pads, wherein the width of the second conductive bump is smaller than that of the first conductive bump, and in basis of the substrate body, the second conductive bump has a greater height than that of the first conductive bump to thereby compensates the height difference after reflowing the first and second conductive bumps.

Description

technical field [0001] The invention relates to a substrate structure, in particular to a substrate structure with conductive bumps. Background technique [0002] Due to the reduction of line width and line distance of electronic components (such as chips and package substrates), the distance between the electrical contact pads of the electronic components is getting smaller and smaller, and solder bumps are formed on each of the electrical contact pads, so as to After reflow (reflow), it will become a solder ball. However, due to the narrow spacing between the electrical contact pads, adjacent solder balls may bridge to cause a short circuit. [0003] Therefore, a metal column with a higher melting point (such as copper and nickel) is formed on the electrical contact pad first, and then a small amount of solder is formed on the metal column (the solder is used as an adhesive layer), so that by reflow Metal pillars are not fused into balls, so this method can be used on fi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488
CPCH01L2224/11H01L2224/14
Inventor 赖杰隆程吕义陈佑全吕长伦
Owner SILICONWARE PRECISION IND CO LTD