COB light source

A light source, blue light technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of object color distortion or color cast, not suitable for human visual preference, and low conversion efficiency of low-voltage power supply, so as to reduce the cost of power supply , high power conversion efficiency, and the effect of improving reflectivity

Inactive Publication Date: 2017-01-11
FOSHAN EVERCORE OPTOELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The color rendering index of most COB products on the market is not high (the general color rendering index Ra is lower than 70), and the color reproduction of objects is poor. The color of the objects we see is easy to be distorted or color cast, which is not suitable for people Eye vision preference; in addition, the power supply of ordinary COB products is generally DC low voltage, and COB products with different powers need to be equipped with power supplies of different specifications, which will lead to more types of power supplies and increased power supply costs. lower

Method used

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Embodiment Construction

[0024] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0025] Such as figure 1 As shown, a COB light source includes a substrate 1, at least one LED chip 2, a dam 3 and fluorescent glue (not shown in the figure), the LED chip 2 is a high-voltage blue LED chip arranged on the substrate 1, The dam 3 has a closed ring structure and is arranged on the substrate 1, the LED chip 2 is arranged in the dam 3, the fluorescent glue is filled in the dam 3, and the fluorescent glue is made of silica gel , yellow-green phosphor and red phosphor.

[0026] The substrate 1 is a metal substrate, and its front is provided with a crystal-bonding area 11 for mounting LED chips 2. More preferably, the surface of the crystal-bonding area 11 is provided with a high reflective layer, and the high ...

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Abstract

The invention relates to a COB source, comprising a substrate, at least one LED chip, a box dam and fluorescent glue, wherein the LED chip is high-voltage blue-ray LED chip set on the substrate, in the closed and circular structure, the box dam is set on the substrate, the LED chip is set in the box dam, and the fluorescent glue is filled in the box dam; the fluorescent glue comprises silicon gel, yellow-and-green fluorescent powder, and red fluorescent powder. The emission peak wavelength of the yellow-and-green fluorescent powder is 530nm-540nm. The total quality of the yellow-and-green fluorescent powder accounts for 8-12% of total quality of silicon gel. The emission peak wavelength of the red fluorescent powder is 620nm-640nm. The total quality of the red fluorescent powder accounts for 8-12% of total quality of silicon gel. The COB light source applies high-voltage blue-ray LED chip to stimulate yellow-and-green fluorescent powder and red fluorescent powder, whose color-rendering index Ra is higher than 80, breaking through problems of low spectrum color gamut and color-rendering index in traditional COB light source, better restoring real color of object and more benefiting health of human eye.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a COB light source. Background technique [0002] As a new generation of light source, LED has the characteristics of energy saving, environmental protection, safety, long life, low power consumption, low heat, high brightness, waterproof, miniature, shockproof, easy dimming, concentrated beam, easy maintenance, etc., and can be widely used in various indications , display, decoration, backlight, general lighting and other fields. [0003] COB light source packaging, that is, chip-on-board packaging, is one of the bare chip mounting technologies. The LED chip is mounted on the printed circuit board. The electrical connection between the chip and the substrate is realized by wire stitching and covered with resin to ensure reliability. With the wide application of COB lighting products, people pay more and more attention to the performance and light color quality of COB prod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/50H01L33/60
CPCH01L25/0753H01L33/501H01L33/504H01L33/60H01L33/62H01L2933/0091
Inventor 王孟源朱思远曾伟强
Owner FOSHAN EVERCORE OPTOELECTRONICS TECH
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