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A device for intelligently detecting the residual amount of solder paste in a solder paste printing machine

An intelligent detection and solder paste technology, which is applied to the general parts of printing machinery, printing machines, printing, etc., can solve the problems of solder paste residual detection and other problems, and achieve the effect of reducing difficulty, preventing tin shortage and improving accuracy

Active Publication Date: 2019-05-14
DALIAN EVERYDAY GOOD ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the above-mentioned defects existing in the prior art, this application provides a device for intelligently detecting the solder paste margin of a solder paste printing machine, which solves the problem of solder paste margin detection in the printing process in the SMT industry

Method used

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  • A device for intelligently detecting the residual amount of solder paste in a solder paste printing machine
  • A device for intelligently detecting the residual amount of solder paste in a solder paste printing machine

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Embodiment 1

[0011] This embodiment provides a device for intelligently detecting the amount of solder paste in a solder paste printing machine, including: a solder paste detection system, a visual collector, a through-beam photoelectric sensor, and a mobile handheld terminal; the visual collector is provided with a signal receiver, The through-beam photoelectric sensor is provided with a signal transmitter; the visual collector and the through-beam photoelectric sensor are placed in the solder paste printing machine, the solder paste detection system is connected to the visual collector through the USB2.0 interface, and the solder paste The detection system can exchange information with the mobile handheld terminal through the WIFI wireless network.

Embodiment 2

[0013] This embodiment provides a method for intelligently detecting the residual amount of solder paste in a solder paste printing machine based on Embodiment 1, specifically:

[0014] S1: When the squeegee in the solder paste printing machine moves to the through-beam photoelectric sensor and blocks its optical path, the through-beam photoelectric sensor transmits the signal to the signal receiver in the visual collector through the signal transmitter;

[0015] S2: The visual collector performs image acquisition after receiving the signal, and then sends the acquired image information to the solder paste inspection system;

[0016] S3: The solder paste detection system calculates and processes the image information, and then obtains the remaining amount of solder paste. Once the remaining amount exceeds the maximum and minimum values ​​of the set threshold range, the solder paste detection system will send a corresponding alarm message Send it to the mobile handheld terminal...

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Abstract

A device for intelligently detecting the soldering paste remaining amount of a soldering paste printer comprises a soldering paste detecting system, a visual collector, a through-beam photoelectric sensor and a mobile handheld terminal. A signal receiver is arranged in the visual collector. A signal projector is arranged in the through-beam photoelectric sensor. The visual collector and the through-beam photoelectric sensor are both arranged in the soldering paste printer. The soldering paste detecting system is connected with the visual collector through a USB 2.0 interface and can be in information interaction with the mobile handheld terminal through a WIFI. By adoption of the device for intelligently detecting the soldering paste remaining amount of the soldering paste printer, the accuracy is greatly improved, and the manual operation difficulty is lowered; and tin insufficiency, detinning and bridge connection and the like can be effectively prevented.

Description

technical field [0001] The invention belongs to the technical field of solder paste printing machines in the SMT industry, and specifically relates to a device for intelligently detecting the residual amount of solder paste in a solder paste printing machine. Background technique [0002] The printing process of solder paste came into being along with the SMT industry of surface mount technology. The quality of the printing process of solder paste is directly related to whether the subsequent placement and reflow process can be carried out normally and orderly. In the current printing process , after the operator applies the solder paste on the stencil, most of the inspection process is still a method of visually observing the solder paste margin. With the continuous printing, the solder paste margin on the stencil is constantly changing, and human The method can easily cause problems such as omission or accuracy, and the insufficient amount of solder paste in the printing p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41F33/00
CPCB41F33/00B41P2233/30
Inventor 于龙义宋作伟
Owner DALIAN EVERYDAY GOOD ELECTRONICS
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