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Preparation technology of insulating Mylar

A process, release film technology, applied in the direction of film/sheet adhesive, lamination, layered products, etc., can solve the problems of low processing efficiency, time-consuming and labor-intensive

Active Publication Date: 2017-04-26
苏州倍瑞得电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the back glue is made of multiple materials, according to the above process, the back glue can only be pasted on the MYLAR release film manually, which is time-consuming and laborious, resulting in low processing efficiency

Method used

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  • Preparation technology of insulating Mylar
  • Preparation technology of insulating Mylar
  • Preparation technology of insulating Mylar

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] figure 1 The one shown in is an insulating Mylar, including MYLAR release film (TP75L-40) a4 and adhesives of three materials bonded on the same plane of MYLAR release film, which are A glue (TESA#68559) a1, B adhesive (TESA#4926) a2 and C adhesive (NO.5603) a3, the above adhesives are not in contact with each other.

[0033] The preparation process of above-mentioned insulating Mylar comprises five operations (see figure 2 and 3 ), where the first process is:

[0034] (1-1) Paste a piece of adhesive tape A on the release surface 1 (HQD-05), and compound a piece of silicone tape along the two long sides of the release surface 1 (HQD-05), and tear off the glue A The release film of the tape itself is replaced with the second release surface (EA2#23MPET) to stick to it;

[0035] (1-2) Use the first set of knife molds to punch positioning holes on the silicone tape. At the same time, the knife faces the second release surface (EA2#23MPET) for step-by-step cutting, and...

Embodiment 2

[0052] Insulated Mylar, including MYLAR release film and adhesives of four materials attached to the same plane of MYLAR release film, which are A glue, B glue, C glue and D glue, and the above adhesives do not touch each other connect. The difference between the preparation process of the insulating mylar and the preparation process of the three-material adhesive tape provided in Example 1 is that after compounding the C adhesive tape, there is an additional step of compounding the D adhesive tape.

Embodiment 3

[0054]Insulated Mylar, including MYLAR release film and adhesives of four materials attached to the same plane of MYLAR release film, which are A glue, B glue, C glue, D glue and E glue. Connect without touching each other. The difference between the preparation process of this insulating mylar and the preparation process of the three-material adhesive tape provided in Example 2 is that after compounding the D adhesive tape, there is an additional step of compounding the E adhesive tape.

[0055] To sum up, the process provided by the present invention is to cut out the shape of the back glue after lamination, instead of cutting out the shape of the back glue before laminating, so it is suitable for the process requirements of mylar automatic production.

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PUM

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Abstract

The invention relates to a preparation technology of insulating Mylar, and especially relates to a preparation technology of Mylar with multiple texture back adhesives. The principle of the technology includes: firstly compounding an adhesive A, cutting the adhesive A, regarding the areas where an adhesive B and an adhesive C are located as waste and performing removal; then compounding the adhesive B, cutting the adhesive B, regarding the areas where the adhesive A and the adhesive C are located as waste and performing removal; and finally compounding the adhesive C, cutting the adhesive C, regarding the areas where the adhesive A and the adhesive B are located as waste and performing removal. The technology includes at least 5 processes, knife lines of the 5 processes are combined to obtain the profile of an MYLAR release film and the back adhesives in the insulating mylar. According to the technology provided by the invention, the profile of the back adhesives is obtained by cutting after gluing rather than gluing after cutting of the profile of the back adhesives, therefore the technology is suitable for the process requirements of automated production of mylar.

Description

technical field [0001] The invention relates to a preparation process of insulating Mylar, in particular to a preparation process of Mylar with back glue of various materials. Background technique [0002] The insulating mylar in the Fpc flexible circuit board is an integrated structure with double-sided adhesive on the MYLAR release film. At present, the preparation process of insulating mylar is: cutting adhesive → cutting MYLAR release film → laminating release paper and adhesive → stamping adhesive → laminating MYLAR release film and adhesive → stamping MYLAR release film and Adhesive → tearing edge material (waste discharge) → pasting release paper. In the above process, the back glue is stamped first, then the formed back glue is pasted on the MYLAR release film, and finally the shape is punched. However, when the back glue is made of multiple materials, according to the above process, the back glue can only be pasted on the MYLAR release film manually, which is time...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02B32B27/06B32B7/12B32B37/12B32B38/00
Inventor 曹金祥竺德云金冬梅余建伟
Owner 苏州倍瑞得电子科技有限公司