HDI circuit board manufacturing process capable of realizing accurate alignment
A circuit board manufacturing and process technology, applied in the direction of multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve the problems of losing the alignment mark function and affecting the precision of the surface graphics manufacturing process, so as to maintain the alignment mark function, The effect of improving the precision of graphics production
Inactive Publication Date: 2017-04-26
JIANGSU BOMIN ELECTRONICS
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Problems solved by technology
In the subsequent process of electroplating and copper filling, if the control is not proper, the holes in the board will be filled and the blind holes in the CCD alignment will be easily filled, which will eventually lose its alignment marking function and affect the subsequent surface pattern production. Process precision
Method used
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[0020] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0021] Such as figure 1 As shown, in a specific embodiment, the HDI circuit board manufacturing process capable of realizing accurate alignment provided by the present invention includes the following steps:
[0022] (1) Cutting: Select a substrate with a copper layer on the upper and lower surfaces for cutting.
[0023] (2) Fabrication of the inner circuit: manufacture the inner circuit on the substrate after cutting to obtain the inner circuit board, and perform quality inspection (AOI) on the circuit board.
[0024] (3) Lamination: The upper and lower sides of the circuit board are alternately laminated with prepreg and copper foil, and then laminated to obtain a multilayer circuit board.
[0025] (4) Make CCD alignment targe...
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The invention discloses an HDI circuit board manufacturing process capable of realizing accurate alignment. The HDI circuit board manufacturing process comprises a step of material cutting: selecting a substrate to carry out material cutting, a step of inner layer line making: carrying out line making on the substrate and obtaining an inner layer circuit board, a step of pressing: laminating prepregs and copper foils at upper and lower sides of the inner layer circuit board and obtaining a multi-layer circuit board, a step of target shooting: making a plurality of CCD alignment target holes in the multi-layer circuit board by laser, a step of making board inside holes: making a plurality of board inside holes in the multi-layer circuit board by laser, a step of electroplating and copper filling: electroplating the multi-layer circuit board so as to complete the copper filling of the board inside holes, and a step of making a surface pattern: based on the CCD alignment target holes, completing pattern making at the surface of the multi-layer circuit board, wherein the both the CCD alignment target holes and the board inside holes are blind holes, and the diameter and depths of the CCD alignment target holes are larger than that of the board inside holes. According to the HDI circuit board manufacturing process, in the process of electroplating and copper filling, the CCD alignment target holes are not filled, thus the alignment identification function is kept, and finally the pattern making precision of subsequent surface pattern making process is improved.
Description
technical field [0001] The invention relates to the field of circuit board production, in particular to an HDI circuit board production process capable of realizing precise alignment. Background technique [0002] The process flow of HDI circuit board includes: material cutting--->inner layer circuit making--->pressing--->making CCD alignment target hole--->making board inner hole--->electroplating copper filling- --> Surface graphic production. [0003] In the prior art, the laser parameters used in the steps of laser targeting and laser plate inner holes are the same, so the specifications (aperture and depth) of the CCD alignment blind holes formed by laser targeting are the same as those of the inner holes of the laser plate formed by the inner holes of the laser plate. The specifications (aperture and depth) are also basically the same. In the subsequent process of electroplating and copper filling, if the control is not proper, the holes in the boar...
Claims
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IPC IPC(8): H05K3/46
CPCH05K3/4679H05K2201/09918H05K2203/166
Inventor 黄继茂周先文王庆军傅廷昌张艳梅
Owner JIANGSU BOMIN ELECTRONICS