Sensing chip packaging component, manufacturing method thereof and electronic device

Abstract

The invention discloses a sensing chip packaging component, a manufacturing method thereof and an electronic device. The sensing chip packaging component comprises a substrate on the uppersurface of which a bonding pad is formed; a sensing chip arranged on the upper surface of the substrate; a dielectric layer attached on the upper surface of the sensing chip; and a packaging material covering the substrate, the sensing chip and the dielectric layer but not including the lower surface of the substrate and the upper surface of the dielectric layer. The sensing chip comprises a protruding part formed on the upper surface of the sensing chip; a sensing chip welding plate formed on the upper surface of the sensing chip; an induction circuit in electric connection with the dielectric layer; and welding wires in connection with the welding plate on the substrate and the welding chip of the sensing chip respectively. According to the invention, since the dielectric layer of the sensing chip packaging component is relatively close to the induction area on the surface of the sensing chip, it is possible to accomplish better biological identification such as fingerprint identification.

Description

technical field [0001] The invention belongs to the field of electronics, in particular, the invention relates to a sensor chip package assembly, a preparation method thereof and electronic equipment. Background technique [0002] At present, biometric chips used in the field of security identification can be used in smart handheld devices. Usually, a medium layer needs to be set between the identification area of ​​the biochip and the finger, and a relatively short distance between the medium layer and the sensing area on the surface of the chip can achieve a relatively accurate identification effect. [0003] However, at present, the encapsulation of the fingerprint recognition chip and the glass lamination process of the dielectric layer are carried out sequentially, which makes it difficult to control the distance between the dielectric layer and the surface sensing area of ​​the biometric chip. [0004] Therefore, the packaging technology of the existing biometric chip...

AI Technical Summary

Problems solved by technology

[0003] However, at present, the encapsulation of the fingerprint identification chip and the glass lamination process of the dielectric layer are carried out sequentially, which makes it difficult to control the distance between the dielectric layer and the sensing area on the surface of the biometric chip.

[0004] Therefore, the packaging technology of the existing biometric chip still needs to be further improved.

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