Medium-temperature silver-free copper-based brazing filler metal and method for preparing same

A copper-based solder, silver-copper technology, applied in manufacturing tools, welding equipment, metal processing equipment, etc., can solve problems such as human harm and increase costs, and achieve the effects of less equipment investment, lower production costs, and environmental protection.

Inactive Publication Date: 2017-05-31
江门市盈盛焊接材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As we all know, silver is an expensive metal, and the use of silver will inevitably greatly increase the cost of the product
Copp

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0039] Example 1

[0040] A medium-temperature silver-free copper-based solder, comprising the following components by weight percentage:

[0041] P 4.0%

[0042] Sn 1.0%

[0043] Si 0.5%

[0044] Sb 0.2%

[0045] B 0.3%

[0046] Ti 0.2%

[0047] Zr 0.2%

[0048] Ni 1.0%

[0049] The balance is Cu.

[0050] Preparation:

[0051] (1) Ingredients: Weigh raw material alloys CuP, CuB, CuTi, CuZr and elemental Sn, Si, Sb, Ni, Cu;

[0052] (2) Melting: Melt the materials prepared in step (1) in an intermediate frequency induction furnace, first add Cu, Si, Ni, and Sb to the melting crucible, and cover the materials with charcoal, turn on the intermediate frequency heating furnace, and control the temperature 900°C, add CuP, CuB, CuTi, CuZr after the charge is completely melted;

[0053] (3) Refining: After the material in step (2) is completely melted, stir the solution with a graphite rod for 5 minutes, control the intermediate frequency power so that the temperature of ...

Example Embodiment

[0056] Example 2

[0057] A medium-temperature silver-free copper-based solder, comprising the following components by weight percentage:

[0058] P 7.5%

[0059] Sn 15.0%

[0060] Si 2.0%

[0061] Sb 1.0%

[0062] B 0.8%

[0063] Ti 1.0%

[0064] Zr 0.8%

[0065] Ni 2.0%

[0066] The balance is Cu.

[0067] Preparation method: same as Example 1.

Example Embodiment

[0068] Example 3

[0069] A medium-temperature silver-free copper-based solder, comprising the following components by weight percentage:

[0070] P 5.0%

[0071] Sn 2.0%

[0072] Si 0.8%

[0073] Sb 0.2%

[0074] B 0.3%

[0075] Ti 0.2%

[0076] Zr 0.2%

[0077] Ni 0.5%

[0078] The balance is Cu.

[0079] Preparation method: same as Example 1.

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PUM

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Abstract

The invention discloses medium-temperature silver-free copper-based brazing filler metal and a method for preparing the same. The medium-temperature silver-free copper-based brazing filler metal comprises, by weight, 4.0%-7.5% of P, 1.0%-15.0% of Sn, 0.5%-2.0% of Si, 0-1.0% of Sb, 0.3%-0.8% of B, 0.2%-1.0% of Ti, 0.2%-0.8% of Zr, 0-2.0% of Ni and the balance Cu. The medium-temperature silver-free copper-based brazing filler metal and the method have the advantages that the copper is used as a matrix for the medium-temperature silver-free copper-based brazing filler metal, diversified non-toxic and inexpensive metal elements are added into the copper, accordingly, characteristics of the medium-temperature silver-free copper-based brazing filler metal can be improved, and the medium-temperature silver-free copper-based brazing filler metal is excellent in braze welding technological characteristic; the medium-temperature silver-free copper-based brazing filler metal is prepared to obtain powder, has low melting temperature and is excellent in braze welding technological performance such as joint filling properties and wetting properties; the medium-temperature silver-free copper-based brazing filler metal prepared by the aid of the method can be flexibly used, is adaptive to weld joints in diversified shapes and is excellent in quality stability.

Description

technical field [0001] The invention relates to the technical field of solder, in particular to a medium-temperature silver-free copper-based solder and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of the economy and the improvement of living standards, the demand for electrical appliances represented by refrigerators, air conditioners, and home appliances is increasing, and the demand for brazing materials for valve pipes and compressor pipes is also increasing. bigger. At present, wire-shaped copper-based alloy solders containing high content of silver or cadmium are commonly used in brazing of copper and copper alloys. relatively bigger. In addition, there is a high content of silver in the solder formula, and copper solder with a silver content of 15%-20% is widely used in the welding of copper alloys in four-way valves, globe valves and compressor pipelines. The mechanical properties are high, and the brazing...

Claims

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Application Information

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IPC IPC(8): B23K35/30B23K35/40
CPCB23K35/30B23K35/40
Inventor 熊进
Owner 江门市盈盛焊接材料科技有限公司
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