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Heat conduction pipe, radiator and electronic equipment

A heat pipe and radiator technology, applied in heat exchange equipment, lighting and heating equipment, electrical equipment structural parts and other directions, can solve problems such as heat conduction that cannot be applied to deformation systems

Inactive Publication Date: 2017-06-20
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this kind of heat pipe is rigid and cannot be deformed after the overall shape is adjusted, so it cannot be applied to the heat conduction of the deformation system.

Method used

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  • Heat conduction pipe, radiator and electronic equipment
  • Heat conduction pipe, radiator and electronic equipment
  • Heat conduction pipe, radiator and electronic equipment

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Experimental program
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Embodiment Construction

[0028] The embodiment of the present invention provides a heat pipe, which has a changeable shape and is suitable for heat conduction of deformation systems.

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] Please refer to the attached Figure 1-6 The heat pipe provided by the embodiment of the present invention includes a tube shell and a liquid-absorbing wick arranged on the inn...

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PUM

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Abstract

The invention provides a heat conduction pipe. The heat conduction pipe comprises a pipe shell and a liquid sucking core arranged on the inner wall of the pipe shell. The pipe shell comprises a first pipe section located at the evaporating end of the heat conduction pipe, a second pipe section located at the condensing end of the heat conduction pipe, and a middle pipe section for connecting the first pipe section and the second pipe section. The middle pipe section is a middle flexible pipe, and the liquid sucking core is of a flexible structure. The middle flexible pipe of the pipe shell and the liquid sucking core are both flexible, the middle shape of the pipe shell can change along with a deformation system, and then the heat conduction pipe is applicable to heat conduction of the deformation system. The invention further provides a radiator and electronic equipment.

Description

technical field [0001] The invention relates to the technical field of computer accessories, and more specifically, relates to a heat pipe, and also relates to a radiator and an electronic device. Background technique [0002] Heat pipes, because of their excellent thermal superconductivity, have been widely used in the field of heat dissipation, especially in thin systems. The heat pipe generally consists of a closed tube shell and a liquid-absorbing core arranged on the inner wall of the tube shell. The inside of the heat pipe is pumped into a negative pressure state and filled with a suitable liquid, which has a low boiling point and is easy to volatilize. One end of the heat pipe is the evaporation end, and the other end is the condensation end. When one end of the heat pipe is heated, the liquid in the heat pipe evaporates rapidly, and the vapor flows to the other end under a small pressure difference, and releases heat, which recondenses into a liquid. Then it flows ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04H05K7/20F28F21/08G06F1/20
CPCF28D15/046F28F21/08G06F1/203H05K7/20336F28D15/0241G06F1/20
Inventor 贾自周孙英
Owner LENOVO (BEIJING) LTD