Device and positioning method for semiconductor laser ld chip package positioning

Abstract

The invention discloses a device for positioning LD chip packaging of a semiconductor laser device. The device comprises a base, a mould strip, a positioning block, a positioning mechanism and COS. The positioning block drives the edge of the COS to move toward inner side relative to a tube tongue; relative extension amount of the LD chip of the COS is a negative value; the shortcoming that the LD chip is easily crashed and broken when an extension amount of an LD emergent light cavity surface in traditional packaging is a positive value is overcome; a negative value of the extension amount of the LD chip is also a need of corresponding industry; a fast axis divergence angle of the LD chip is further larger than a specific angle selected by the invention, and thus a risk of light shading is avoided. By driving the COS positioning through the positioning block, consistent extension tube seat of the emergent light cavity surface is ensured in an LD chip packaging process, and accurate positioning in batch production is realized.

Description

technical field [0001] The invention relates to the field of semiconductor lasers, in particular to a semiconductor laser LD chip packaging and positioning device and positioning method. Background technique [0002] After decades of development, semiconductor lasers are becoming more and more familiar to the society. Due to its small size, light weight, high electro-optical conversion efficiency, long life and high reliability, it has gradually replaced the use of gas and solid-state lasers in the fields of communication, medical treatment, display, industrial production and security. The scope is also gradually expanding. Semiconductor lasers are also gradually moving from the low-end application market to high-end markets such as medical and national defense. Therefore, in the past, only broad conditions such as the power spot of semiconductor lasers during operation have gradually become strict standards for high product consistency and high performance repeatability. ...

AI Technical Summary

Problems solved by technology

This original packaging process that does not use high-precision automation often has poor positioning consistency of LD relative to the end face of the tube seat tongue, and for the new application requirements of ever-changing lasers, TO-packaged semiconductor lasers are used with more lenses, and LD chips The consistency of the LD will affect the use effect, and the prominent LD cannot meet the use, so how to propose a simple and operable method to realize the precise positioning of the LD and the tube base, and to achieve the consistency of the packaging accuracy under the original packaging process becomes important research topic

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