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Control method, electronic device and heat dissipation base

A technology of electronic equipment and heat dissipation base, which is used in hardware monitoring, electrical digital data processing, instruments, etc., and can solve problems such as inability to match data processing performance.

Active Publication Date: 2017-11-17
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the user's use, the speed of the fan in the cooling base often needs to be adjusted manually by the user, which cannot accurately match the current data processing performance of the notebook computer.

Method used

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  • Control method, electronic device and heat dissipation base
  • Control method, electronic device and heat dissipation base
  • Control method, electronic device and heat dissipation base

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Based on the foregoing embodiments, in order to increase the operating speed of the electronic device and adapt it to the current load condition of the heat dissipation base, Figure 3-1 It is the first schematic flow chart of the control method in the embodiment of the present invention, see Figure 3-1 As shown, the above methods include:

[0049] S311: Receive the base information from the cooling base through the first communication interface;

[0050] Here, the cooling fan sends base information to the electronic device through the CC protocol, and an embedded controller (EC, Embedded Controller) in the electronic device obtains the base information. At this time, the base information may include a current load parameter of the cooling fan in the cooling base, and of course, may also include a preset load upper limit of the cooling fan.

[0051] S312: Determine the current load parameter of the cooling fan in the cooling base according to the base information;

...

Embodiment 2

[0071] Based on the foregoing embodiments, in practical applications, Figure 1-2 It is the second schematic diagram of the structure of the electronic device and the heat dissipation base in the embodiment of the present invention, see Figure 1-2 As shown, the electronic device 10 is externally connected to the heat dissipation base 30 through the first communication interface 20 . The electronic device 10 can be placed on the support surface 31 of the heat dissipation base, the heat generated by the electronic device is conducted to the support surface, and the heat is exchanged by the cooling fan on the back side of the support surface.

[0072] Further, a temperature sensing device 32 is also provided on the supporting surface 31, and the temperature sensing device 32 includes at least one infrared sensor (InfraRed thermal sensor). When the electronic equipment is placed on the supporting surface, the temperature sensing device can collect the surface temperature value o...

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Abstract

The embodiment of the invention discloses a control method, comprising the steps of receiving base information of a heat dissipation base externally connected with an electronic device, through a first communication interface; and adjusting performance parameters of the electronic device and / or the performance parameters of the heat dissipation base according to the base information and a preset strategy, wherein the performance parameters are used for representing the data processing performance of the electronic device. The embodiment of the invention also discloses the electronic device.

Description

technical field [0001] The invention relates to the field of terminal control, in particular to a control method, electronic equipment and a heat dissipation base. Background technique [0002] The heat dissipation base is a kind of heat sink for electronic equipment. It fits the size of the electronic equipment and is placed under the electronic equipment. The airflow is driven by the internal turbo fan and flows in from the air inlet below the electronic equipment, so that the heat generated by the electronic equipment can be dissipated as soon as possible. Diffusion to the outside to make up for the lack of heat dissipation of electronic equipment, especially notebook computers, and thus improve the operating speed of electronic equipment. [0003] Currently, taking a notebook computer as an example, the notebook computer is connected to the cooling base through a Universal Serial Bus (USB, Universal Serial Bus), and can supply power to the cooling base. During the user'...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F11/30G06F13/40G06F13/42
CPCG06F1/203G06F11/3058G06F13/4068G06F13/4221G06F13/4282
Inventor 莫志坚
Owner LENOVO (BEIJING) LTD