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Combined environmental stress simulation method

A technology that integrates environment and simulation methods, and is applied in special data processing applications, instruments, electrical digital data processing, etc., and can solve problems such as failure to provide stress simulation, restricting reliability, and simulation results that do not conform to reality.

Inactive Publication Date: 2018-01-09
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

However, ANSYS software does not provide stress simulation in a comprehensive environment, which makes the simulation results unrealistic for structures in a comprehensive environment, which restricts our research on its reliability

Method used

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  • Combined environmental stress simulation method
  • Combined environmental stress simulation method

Examples

Experimental program
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Effect test

Embodiment

[0047] In this embodiment, ANSYS software is used to perform simulation analysis of single environmental stress and comprehensive environmental stress simulation analysis respectively. The structure of the simulation model is as follows figure 2 As shown, on the basis of this model, a pressure load of 2MPa is applied, and the maximum stress is obtained through simulation analysis as 27MPa, and the stress distribution diagram is as follows image 3 Shown is the stress distribution under a single pressure environment;

[0048] In the simulation model structure figure 2 On the basis of , when a temperature load of 600 degrees is applied, the maximum stress obtained through simulation analysis is 57MPa, and the stress distribution diagram is as follows Figure 4 Shown is the stress distribution under a single temperature environment.

[0049] In the simulation model structure figure 2 On the basis of , when a pressure load of 2MPa and a temperature load of 600 degrees and a ...

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Abstract

The invention relates to a finite element simulation technology, and discloses a combined environmental stress simulation method which can analyze the stress distribution of a simulation model under acombined environment and make simulation results better conform to actual situations. The method comprises the steps that a, a geometric model is created, material parameters at different temperatures are defined, the model is segmented, and a grid is divided, and a finite element model is generated; b, heat-structural coupling prestress analysis conducted, wherein the temperature and the pressure load are applied to obtain comprehensive stress of thermal stress generated by high temperature and a static stress generated by a pressure load, and the comprehensive stress serves as prestress forsubsequent random vibration analysis; c, the prestress is loaded into the finite element model for modal analysis with prestress; d, vibration excitation is applied, random vibration analysis is carried out, and a random vibration stress result is obtained; e, a random vibration stress result, the thermal stress generated by the high temperature and a static stress result generated by the pressure load are superposed. The method is suitable for combined environmental stress simulation analysis.

Description

technical field [0001] The invention relates to finite element simulation technology, in particular to a simulation method for comprehensive environmental stress. Background technique [0002] With the rapid development of science and technology, simulation has become an indispensable means for the development of various complex systems. Since many products work in comprehensive environments such as high temperature, high pressure, and vibration, the research on their reliability is becoming more and more important. Through simulation, we can shorten the R&D cycle, improve the production process, reduce costs, and more realistically understand the impact of the product on the external environment, of which stress simulation analysis is an extremely important part. [0003] At present, many studies are often carried out in a single environment such as high temperature or high pressure when performing stress simulation analysis on structures. Various factors under the compre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 荣丽梅刘博刘魁邓珣于奇
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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