Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Substrate treating system

A technology for a substrate processing system and a substrate processing device, which is applied to conveyor objects, static electricity, electrical components, etc., and can solve problems such as the inability to remove static electricity from substrates

Active Publication Date: 2018-02-06
SEMES CO LTD
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conventional ionizers are not actually effective in removing static electricity on substrates by removing static electricity or charged particles in a wide area in which processes are performed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate treating system
  • Substrate treating system
  • Substrate treating system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The present invention is susceptible to various modifications and forms, and specific embodiments of the present invention will be shown in the drawings and described in detail. However, the present invention is not limited to specific disclosed forms, but it should be understood that the scope of the present invention includes all changes related to the spirit and technical scope of the present invention and their equivalents or substitutes. Detailed descriptions of known technologies related to the present invention will be omitted so as not to obscure the technical essence of the present invention.

[0023] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Terms in a singular form may include plural forms unless otherwise specified. The terms "comprising" and "having" are used to indicate the presence of features, quantities, steps, operations, elements, parts or their combin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Surface resistanceaaaaaaaaaa
Surface resistanceaaaaaaaaaa
Surface resistanceaaaaaaaaaa
Login to View More

Abstract

Disclosed is a substrate treating system. The substrate treating system includes an index unit having a port, on which a container containing a substrate is positioned, and an index robot, a process executing unit having substrate treating apparatuses for treating the substrate and a main transferring robot for transferring the substrate, and a buffer unit disposed between the process executing unit and the index unit and in which the substrate fed between the process executing unit and the index unit temporarily stays. Each of the index robot, the substrate treating apparatuses, the main transferring robot, and the buffer unit includes a conductive part contacting the substrate to remove static electricity of the substrate.

Description

technical field [0001] Embodiments of the inventive concepts described herein relate to a substrate processing system. Background technique [0002] Contaminants on the substrate surface, such as particles, organic contaminants, and metal contaminants, greatly affect device quality and yield. Therefore, a cleaning process of removing various contaminants or unnecessary films attached to the surface of the substrate is very important, so the process of cleaning the substrate is performed before and after a unit process of manufacturing a semiconductor. [0003] The cleaning methods used in the current semiconductor manufacturing process are mainly divided into dry cleaning and wet cleaning, and wet cleaning is divided into batch type and single wafer type. The batch type removes pollutants through chemical solutions by immersing the substrate in chemicals, and the single wafer type Contaminants are removed by supplying chemicals onto the surface of the substrate as it is spu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/67H05F3/02
CPCH01L21/67023H05F3/02H01L21/67184H01L21/67778H01L21/68707H01L21/02041H01L21/02057H01L21/67742H01L21/67766H01L21/67769B65G49/07H01L21/67309H01L21/67781
Inventor 李廷焕吴来泽
Owner SEMES CO LTD
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More