Substrate treating system

Abstract

Disclosed is a substrate treating system. The substrate treating system includes an index unit having a port, on which a container containing a substrate is positioned, and an index robot, a process executing unit having substrate treating apparatuses for treating the substrate and a main transferring robot for transferring the substrate, and a buffer unit disposed between the process executing unit and the index unit and in which the substrate fed between the process executing unit and the index unit temporarily stays. Each of the index robot, the substrate treating apparatuses, the main transferring robot, and the buffer unit includes a conductive part contacting the substrate to remove static electricity of the substrate.

Description

technical field [0001] Embodiments of the inventive concepts described herein relate to a substrate processing system. Background technique [0002] Contaminants on the substrate surface, such as particles, organic contaminants, and metal contaminants, greatly affect device quality and yield. Therefore, a cleaning process of removing various contaminants or unnecessary films attached to the surface of the substrate is very important, so the process of cleaning the substrate is performed before and after a unit process of manufacturing a semiconductor. [0003] The cleaning methods used in the current semiconductor manufacturing process are mainly divided into dry cleaning and wet cleaning, and wet cleaning is divided into batch type and single wafer type. The batch type removes pollutants through chemical solutions by immersing the substrate in chemicals, and the single wafer type Contaminants are removed by supplying chemicals onto the surface of the substrate as it is spu...

AI Technical Summary

Problems solved by technology

However, conventional ionizers are not actually effective in removing static electricity on substrates by removing static electricity or charged particles in a wide area in which processes are performed

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