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Display panel encapsulation method, display panel and display device

A technology of display panel and packaging method, which is applied in the direction of organic semiconductor devices, semiconductor devices, electrical components, etc., and can solve problems such as inaccurate coating areas

Active Publication Date: 2018-04-13
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The packaging method of the display panel replaces the chemical vapor deposition (CVD) mask with a photoresist mask, thereby avoiding the inaccurate coating area caused by the deformation of the CVD mask due to long-term continuous use.

Method used

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  • Display panel encapsulation method, display panel and display device
  • Display panel encapsulation method, display panel and display device
  • Display panel encapsulation method, display panel and display device

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Embodiment Construction

[0033] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Apparently, the described embodiments are some of the embodiments of the present disclosure, not all of them. Based on the described embodiments of the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without creative effort fall within the protection scope of the present disclosure.

[0034] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those skilled in the art to which the present disclosure belongs. "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importan...

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Abstract

The invention discloses a display panel encapsulation method, a display panel and a display device. The display panel encapsulation method comprises the following steps: forming at least one layer ofthin film encapsulated inorganic material layer on the film packaging area of the display substrate; making a photoresist pattern on the thin film encapsulated inorganic material layer; and etching the thin film encapsulated inorganic material layer with the photoresist pattern as a mask to form a thin film encapsulated inorganic layer including a first opening pattern. The display panel encapsulation method replaces the chemical vapor deposition (CVD) mask plate with the photoresist mask, therefore, the problems such as the coating area is inaccurate caused by long time continuous using deformation of the CVD mask are avoided.

Description

technical field [0001] At least one embodiment of the present disclosure relates to a packaging method of a display panel, a display panel and a display device. Background technique [0002] Organic light-emitting diode display devices are very sensitive to water vapor and oxygen, and the water vapor and oxygen that penetrate into the device are the main factors affecting the life of the device. Therefore, thin film encapsulation (Thin Film Encapsulation, TFE) is very important for organic light-emitting diode devices. At present, the common TFE packaging structure is: inorganic material + organic material + inorganic material film layer structure, and the electroluminescent material is encapsulated inside the device to achieve the purpose of blocking water and oxygen, thereby providing protection for the electroluminescent material. In the packaging process, the chemical vapor deposition process (CVD) is generally used to make the inorganic layer. When the inorganic layer c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K59/8731H10K71/231H10K50/844H10K71/00H10K71/10H10K71/236H10K2102/00H10K2102/311
Inventor 孙泉钦张嵩肖昂李端明
Owner BOE TECH GRP CO LTD
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