Computer heat dissipation apparatus

A technology of a heat dissipation device and a computer, applied in the field of computers, can solve the problems of insufficient heat dissipation and insufficient heat dissipation of computers, and achieve the effects of rapid and sufficient heat dissipation, time saving, and rapid heat dissipation

Inactive Publication Date: 2018-04-17
安徽尚易信息技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a heat dissipation device for a computer, which solves the problem that the heat dissipation of the computer is not fast enough and sufficient

Method used

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  • Computer heat dissipation apparatus
  • Computer heat dissipation apparatus

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] see Figure 1-4, the present invention provides a technical solution: a cooling device for a computer, including a base plate 1, which can play a good supporting role and make the device more stable. The top of the base plate 1 is located on the other side of the box body 2 The side is fixedly connected with an electric telescopic rod 18, the electric telescopic rod 18 can be freely stretched, and the top of the electric telescopic rod 18 ...

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Abstract

The invention discloses a computer heat dissipation apparatus. The computer heat dissipation apparatus comprises a bottom plate; the top of the bottom plate is fixedly connected with a box body; a movable plate is glidingly connected between the two sides of the inner walls of the box body through sliding blocks; the top, on one side of the box body, of the bottom plate is fixedly connected with amotor through a connecting block; one end of a motor output shaft is sleeved with a first bevel gear; and one side, positioned at the bottom of the movable plate, of the inner wall of the box body isrotationally connected with a crank shaft through a bearing, and one end of the crank shaft runs through the box body and extends to one side of the box body. The invention relates to the technical field of the computer. By virtue of the computer heat dissipation apparatus, high-speed and complete heat dissipation of the computer can be realized, so that the computer can be subjected to high-speed and efficient heat dissipation, the heat dissipation time is saved, damage to the computer caused by an overhigh temperature can be well avoided, and unnecessary economic loss can be avoided.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a cooling device for a computer. Background technique [0002] A computer is a modern intelligent electronic device that can automatically and quickly perform a large number of numerical calculations and various information processing according to a pre-stored program. It is composed of hardware and software. The two are inseparable. People do not install any software. The computer is called bare metal. With the development of science and technology, some new types of computers have emerged: biological computers, photonic computers, quantum computers, etc. On May 24, 1954, the transistor electronic computer was born. On October 29, 1969, people realized the interconnection of two computers for the first time. The inventor of the computer is John von Neumann. The computer is one of the most advanced scientific and technological inventions in the 20th century. Production activit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20
CPCH05K7/20736G06F1/20
Inventor 许道强
Owner 安徽尚易信息技术有限公司
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