Residual-stress measurement device and residual-stress measurement method
A residual stress and measurement device technology, applied in the direction of measuring devices, instruments, scientific instruments, etc., can solve the problem of time-consuming and shorten the measurement time
Active Publication Date: 2018-04-17
SINTOKOGIO LTD
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[0005] However, the device described in Patent Document 1 may take time to measure the residual stress
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[0018] Hereinafter, this embodiment will be described with reference to the drawings. In addition, in the following description, the same code|symbol is attached|subjected to the same or equivalent element, and the overlapping description is abbreviate|omitted.
[0019] The residual stress measurement device 1 of the present embodiment is a device for measuring the residual stress of a measurement object using X-rays. The residual stress measurement device 1 can be employed, for example, when inspecting the quality of manufactured products in a factory production line, but is not limited thereto. The object to be measured can be, for example, non-oriented (isotropic crystal structure) and formed of a metal polycrystalline material.
[0020] figure 1 It is a schematic diagram explaining the structure of the residual stress measurement apparatus 1 of this embodiment. Such as figure 1 As shown, the residual stress measurement device 1 includes a device main body 100 including...
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This residual-stress measurement device is provided with an X-ray source (10) for irradiating X-rays at a specimen (S) to be measured; a first detection element (11A) for detecting, at a first detection position, the intensity of X-rays diffracted from the specimen to be measured; a second detection element (11B) for detecting, at a second detection position different from the first detection position, the intensity of X-rays diffracted from the specimen to be measured; a movement mechanism (120) for causing each of the first detection element and the second detection element to move along a straight line extending in a direction orthogonal to the direction of incidence of the X-rays; a movement control unit (21) for controlling the detection positions of each of the first detection element and the second detection element by driving the movement mechanism; and a stress calculation unit (22) for calculating the residual stress of the specimen to be measured on the basis of peaks in intensity of the diffracted X-rays detected due to each of the first detection element and the second detection element being moved by the movement mechanism. According to the present invention, it is possible to shorten the time for measuring residual stress.
Description
technical field [0001] The invention relates to a residual stress measuring device and a residual stress measuring method. Background technique [0002] Patent Document 1 describes an apparatus for measuring residual stress of an object to be measured using X-rays. This device includes: an X-ray emitter that emits X-rays to the object to be measured, an imaging plate that receives diffracted light from the object to be measured, a rotation mechanism that rotates the imaging plate, a laser device that reads from the imaging plate, and controls these components. controller. [0003] The controller stores in advance the shape of the diffraction ring corresponding to the residual stress as a reference. Then, the device uses the imaging plate to receive the diffracted light from the object to be measured, and uses the rotating mechanism to rotate the imaging plate while using the laser device to read the photosensitive intensity to obtain the diffraction ring, and compares the ...
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IPC IPC(8): G01N23/207
CPCG01N23/207G01N23/20008
Inventor 小林祐次松井彰则
Owner SINTOKOGIO LTD