Wafer inspection method and wafer inspection apparatus

Abstract

Provided is a wafer inspection method whereby whether there is a pit in a wafer surface can be inspected. This wafer inspection method is characterized by including: a step for picking up defects of awafer (1) using a first optical system (10); a step for selecting pit candidates from among thus picked up defects; and a step for classifying the pit candidates into a group of pit defects and a group of defects other than the pit defects using a second optical system (20).

Description

technical field [0001] The present invention relates to a wafer inspection method and a wafer inspection device for inspecting whether there are defects that may occur on the wafer surface, in particular to a wafer inspection method capable of inspecting whether there are pits on the wafer surface . Background technique [0002] In the manufacturing process of a semiconductor element, in order to improve the yield and reliability, the defect inspection technique of the surface of the wafer which is a substrate of a semiconductor element becomes extremely important. Here, the ideal situation is that there are no defects on the wafer surface at all. However, from the viewpoint of device characteristics, device manufacturing yield, etc., there are also defects that do not cause problems even if they exist. Therefore, inspection of the wafer surface is carried out based on predetermined judgment criteria, and judgment of good or defective is performed. [0003] In addition, in...

AI Technical Summary

Problems solved by technology

That is, when the wafer is diced after the device is produced, the pit becomes the starting point of cracking of the wafer, and the cracking of the wafer may occur

If wafer breakage occurs during the dicing process, all components already completed on the wafer will become defective, so the pit can become a fatal defect in the component manufacturing process

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