A kind of preparation method of multilayer film X-ray zone plate

Abstract

The invention provides a preparation method of a multilayer-film X-ray zone plate. Firstly, according to the designed height of the zone plate, the side surface of a central fine wire (1) serving as amain body support of the zone plate is selectively shielded, then two film materials are alternately deposited on the surface of the central fine wire (1) with a film deposition method, a multilayerfilm serves as a zone structure of the zone plate, the thickness of the multilayer film is decreased layer by layer in the radial direction according to the design requirement of the zone plate, a protective film is deposited on the outer surface of the multilayer film, a shielding object on the central fine wire (1) is removed after deposition is completed, multiple multilayer-film zone plate structures are obtained on the central fine wire (1), then each multilayer-film section is etched and polished by ion beams, finally, the central fine wire (1) is cut off in the position without the multilayer film, and the required zone plate can be obtained.

Description

technical field [0001] The invention relates to a preparation method of a multilayer film X-ray zone plate. Background technique [0002] The wavelength of X-rays is between 0.01-10nm. Microscopic techniques in the X-ray band can be used to see smaller structures inside objects with higher resolution. It can be used for non-destructive testing of substances and three-dimensional microscopic imaging, and has the ability to detect thick samples. Potential for nanometer-resolution imaging. The zone plate is the core component of X-ray microscopic imaging technology, and its resolution is basically equivalent to the width of the outermost ring of the zone plate. Therefore, to achieve high-resolution detection and imaging of X-rays, it is necessary to reduce the outermost ring of the zone plate width. At the same time, in order to improve the diffraction efficiency of hard X-rays with shorter wavelengths, the height of the zone plate needs to be increased so that the phase diff...

AI Technical Summary

Problems solved by technology

At present, there are two commonly used slice polishing processes. One is to mount the filament with multi-layer film, and use a polishing instrument to polish and thin it to the required thickness. The section roughness of the zone plate obtained by this method is relatively low. The second is to use the focused ion beam for cutting. The section roughness of the zone plate obtained by this method is small, but the polishing time is long and the cost is high, and because the diameter of the zone plate is relatively large, the section of the zone plate will appear after ion beam cutting. Tilting the sidewalls, which in turn changes the focal position and other properties of the zone plate

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