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A kind of preparation method of x-ray zone plate

A zone plate and X-ray technology, which is applied in the field of preparation of X-ray zone plates, can solve the problems of the small outermost ring width of the zone plate and the inability to take into account the large aspect ratio, and achieves a high success rate and a wide range of The effect of application prospects and large application prospects

Active Publication Date: 2020-04-07
JIAXING KEMIN ELECTRONICS EQUIP TECH
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Problems solved by technology

[0003] The purpose of the present invention is to provide a method for preparing an X-ray zone plate to solve the problem that the small outermost ring width and large aspect ratio of the zone plate processed by the prior art cannot be balanced

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  • A kind of preparation method of x-ray zone plate
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  • A kind of preparation method of x-ray zone plate

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Embodiment Construction

[0038] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0039] Such as figure 1 As shown, the embodiment of the present invention provides a method for preparing an X-ray zone plate, which specifically includes the following steps:

[0040] Step 110, preparing a support body with circular holes according to the thickness and diameter of the required zone plate;

[0041] In this example, if figure 2...

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Abstract

The invention provides a preparation method of an X-ray zone plate. The preparation method of an X-ray zone plate includes the steps: preparing a support body with circular holes according to the thickness and diameter of a desired zone plate; preparing a mask plate on the support body, wherein the mask plate is a circular structure having a diameter slightly greater than the diameter of the eachcircular hole of the support body; performing spin coating by spin coating photoresist on two sides of the support body or in a glue spraying mode, and performing exposure development, wherein the photoresist at the circular hole parts of the support body is developed; alternately depositing a first film material and a second film material on the surface of the support body through an atomic layerdeposition technology to form a thin film girdle structure of the zone plate, wherein the thin film girdle structure is decreased layer by layer; etching the thin film material deposited on the edgeof the support body; cleaning the photoresist on the support body; and etching the redundant thin film material nearby the circular holes on the support body. The preparation method of an X-ray zone plate can obtain minimum outermost ring width by means of the atomic layer deposition technology, and the control precision can reach the nanometer level.

Description

technical field [0001] The invention relates to the technical fields of microelectronics and optics, in particular to a preparation method of an X-ray zone plate. Background technique [0002] X-rays have a short wavelength and a large penetration depth. They can observe the internal three-dimensional structure of thick materials, and have the potential to image thick samples with nanometer resolution. Fresnel zone plate is the core component of X-ray microscopic imaging technology, and its imaging resolution is determined by the width of the outermost ring. For hard X-rays with high energy, in order to obtain a relatively high diffraction efficiency, the zone plate needs to have sufficient thickness to cause the X-rays to shift the π phase, so it is of great significance to prepare a zone plate with a large aspect ratio. In the past ten years, people have been using the technical route of combining electron beam exposure and X-ray lithography to prepare high-resolution har...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G21K1/06
CPCG21K1/062
Inventor 卢维尔夏洋孔祥东韩立李艳丽门勇
Owner JIAXING KEMIN ELECTRONICS EQUIP TECH
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