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bernoulli sucker

A suction cup and body technology, applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of fog on the wafer surface and low gas temperature, and achieve the effect of avoiding fog defects

Active Publication Date: 2020-05-15
ZING SEMICON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a Bernoulli chuck, which is used to solve the problem in the prior art caused by the low temperature of the gas discharged from the Bernoulli chuck when absorbing the wafer. The problem of foggy defects on the wafer surface

Method used

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Embodiment Construction

[0036] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0037] see figure 1 and figure 2 . It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic concept of the present invention, although only the components related to the present invention are shown in the diagrams rather than the number, shape and Dimensional drawing, the shape, quantity and proportion of each component can be changed arbitrarily during actual implementation, an...

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Abstract

The invention provides a Bernoulli chuck, comprising: a holding portion and a main body portion, wherein a gas main line is formed in the holding portion, a gas sub-line is formed in the main body portion, and a plurality of vent holes are formed on the lower surface of the main body portion; the first end of the first portion of the second gas sub-line is in communication with the gas main line,the second end of the first portion of the gas sub-line extends to one end of the main body portion away from the holding portion; the first end of the second portion of the gas sub-line is in communication with the second end of the first portion of the gas sub-line, the second end of the second portion of the gas sub-line extends from one end of the main body portion away from the holding portion to one end of the main body portion near the holding portion; the third portion of the gas sub-line is in communication with the second end of the second portion of the gas sub-line; and the vent holes are in communication with the third portion of the gas sub-line. The Bernoulli chuck provided by the invention may ensure that the temperature of the ejected gas is close to the temperature of thewafer, thereby effectively avoiding the generation of hazy defects.

Description

technical field [0001] The invention belongs to the technical field of semiconductor equipment, in particular to a Bernoulli suction cup. Background technique [0002] 12-inch epiwafers are widely used in logic chips because of the additional silicon layer that removes so-called COPs (crystal native particle defects). In the existing technology, AMAT Centura and ASM Epsilon are the two most widely used epitaxial equipments. In order to pass the wafer in and out from the reaction chamber of the epitaxial equipment, it is necessary to use the Bernoulli suction cup to absorb the wafer; when using the Bernoulli suction cup to absorb and transfer the wafer, there is a layer of gas between the wafer and the Bernoulli suction cup layer, the wafer is not in direct contact with the Bernoulli chuck. [0003] However, when a Bernoulli chuck is used to adsorb a wafer, due to the low temperature of the gas discharged from the exhaust hole of the Bernoulli chuck, these lower temperature...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/68H01L21/683
CPCH01L21/68H01L21/6838H01L2221/683
Inventor 季文明刘源
Owner ZING SEMICON CORP
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