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Wafer dryer

A dryer and wafer technology, applied in dryers, drying, drying of solid materials, etc., can solve problems such as damage, aging of sealing rings, affecting the environmental stability of dryers, etc.

Inactive Publication Date: 2018-12-11
HUAIAN IMAGING DEVICE MFGR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the drying process of the dryer, the temperature of the cavity of the dryer is relatively high. The air will cause the hot air inside the dryer to condense to produce particles (water droplets or other impurity particles), which will adversely affect the quality of the finished chip; in addition, because the cavity of the dryer needs to be frequently opened and closed to place the chip Round, the O-Ring of the cavity is aging, damaged or even gradually fails, which will cause the external cold air to enter the dryer, which will also adversely affect the stability of the internal environment of the dryer

Method used

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Embodiment Construction

[0023] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present disclosure unless specifically stated otherwise.

[0024] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way intended as any limitation of the disclosure, its application or uses.

[0025] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered a part of this description.

[0026] In all examples shown and discussed herein, any specific values ​​should be construed as illustrative only, and not as limiting. Therefore, other examples of the exemplary embodiment...

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Abstract

The disclosure relates to a wafer dryer and an operating method thereof. In one embodiment, the invention relates to a wafer dryer, comprising: a baseplate; a chamber including a sidewall and arrangedon the baseplate; a plurality of gas guide holes surrounding the sidewall outside the chamber, wherein the gas guide holes discharge a gas in a direction substantially perpendicular to the baseplate,the gas surrounding the sidewall forms a gas barrier, and a difference between the temperature of the gas and the temperature in the chamber is less than 30 DEG C.

Description

technical field [0001] The present disclosure relates generally to dryers, and more particularly to wafer dryers to be used during chip fabrication. Background technique [0002] Wafers need to be dried in many processes of chip manufacturing, for example, wafers need to be dried during the photolithography process. [0003] In the manufacturing process of the chip, a pattern transfer process is required, including a photolithography process. Photolithography is a graphic duplication technology and a key technology in the chip manufacturing process. In simple terms, lithography is inspired by photographic technology, and uses the photosensitive properties of photoresist to accurately copy the pattern of the photolithography mask onto the photoresist coated on the wafer. Before the photoresist is spin-coated onto the wafer, it is necessary to dry the wafer surface because the wafer surface is easy to absorb moisture, which will affect the adhesion of the photoresist. After...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F26B21/10F26B25/00
CPCF26B21/10F26B25/00
Inventor 唐磊颜廷彪杨军
Owner HUAIAN IMAGING DEVICE MFGR CORP