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A split heat dissipation industrial control main board

An industrial control motherboard and split-type technology, which is applied in the direction of digital processing power supply distribution, instruments, and electrical digital data processing, etc., can solve the problems of using space to increase the insertion slot, the heat dissipation effect is not targeted, and the insertion interface is scarce, etc., to achieve good results. Prospect of use, good effect of targeted heat dissipation and cooling effect

Inactive Publication Date: 2018-12-14
合肥金新允电子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The industrial control motherboard is a motherboard used in industrial occasions. It is adopted by industrial computers. It can adapt to wide temperature environments, harsh environments, and long-term high-load work according to requirements. According to the structure and size of the motherboard, it can be divided into: full-length cards, Half-length cards, 5.25 inches, 3.5 inches, PC104 architecture, etc. The components of industrial control motherboards are generally different from commercial materials, and need to consider the needs of industrial occasions such as high temperature resistance and humidity resistance. In order to enhance the EMC / EMI performance of the motherboard and enhance the stability of the motherboard Industrial motherboards are designed with 6-layer and above PCB circuit boards, and industrial control motherboards generally use low-power chipsets to save energy and improve environmental adaptability; existing industrial control motherboards have certain disadvantages when used, and cannot Making full use of space to increase the number of insertion slots cannot meet more needs of users, and there is a problem of lack of insertion interfaces, and the heat dissipation effect is not targeted, and the heat dissipation effect is poor, which affects the service life of components. brought a certain impact, for this reason, we propose a split type heat dissipation industrial control motherboard

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  • A split heat dissipation industrial control main board
  • A split heat dissipation industrial control main board
  • A split heat dissipation industrial control main board

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Embodiment Construction

[0019] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0020] Such as Figure 1-3 As shown, a split heat dissipation industrial control motherboard includes a PCB board 1, a fixing hole 2 and an additional hole 3 are opened on the outer wall of the PCB board 1, and a debugging serial port 4 is provided on the outer surface of the upper end of the PCB board 1, close to the PCB board 1 An ADC port 5 is provided on one side of the debugging serial port 4 on the outer surface of the upper end, and a USB port 6 is provided on a side near the ADC port 5, and an Ethernet port 7 is provided on a side near the USB port 6, A SATA port 8 is provided at the rear position close to the Ethernet port 7, a COM interface 9 is provided at a side position close to the SATA port 8, and a serial port extension terminal 10...

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Abstract

The invention discloses a split heat dissipation industrial control main board including a PCB, the outer wall of the PCB is provided with a fixing hole and an additional hole, and the outer surface of the upper end of the PCB is provided with a debugging serial port, An ADC port is arranged at a position close to one side of the debugging serial port on the outer surface of the upper end of the PCB, and a USB port is arranged at a position close to one side of the ADC port, an Ethernet port is arranged close to one side of the USB port, a SATA port is arranged close to the rear side of the Ethernet port, a COM interface is arranged close to one side of the SATA port, and a serial port expansion end is arranged close to one side of the COM interface. The invention discloses a split heat dissipation industrial control main board, which is provided with an additional hole, a split micro board, an expanded PCI slot, an air dispersion fin and a fan, can extend a split main board at the installation position, increases the number of insertion, simultaneously has better targeted heat dissipation and cooling effect, and brings better use prospect.

Description

technical field [0001] The invention relates to the field of industrial control motherboards, in particular to a split-type heat dissipation industrial control motherboard. Background technique [0002] The industrial control motherboard is a motherboard used in industrial occasions. It is adopted by industrial computers. It can adapt to wide temperature environments, harsh environments, and long-term high-load work according to requirements. According to the structure and size of the motherboard, it can be divided into: full-length cards, Half-length cards, 5.25 inches, 3.5 inches, PC104 architecture, etc. The components of industrial control motherboards are generally different from commercial materials, and need to consider the needs of industrial occasions such as high temperature resistance and humidity resistance. In order to enhance the EMC / EMI performance of the motherboard and enhance the stability of the motherboard Industrial motherboards are designed with 6-layer...

Claims

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Application Information

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IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/181G06F1/20
Inventor 贾中全丁晓娟杜立村
Owner 合肥金新允电子技术有限公司