Method and apparatus for testing mainboard of computer

Abstract

This invention discloses one computer master board test device and method, which is used for CPU sealed with FC-LGA and to test circuit connection between CPU and north bridge chip, wherein, the test device comprises one display unit, one resistance with one end connected to base level and with other end as test point; one logic circuit to connect above test point and display unit; the above program circuit is one PLD chip to control the logic circuit through test point level changes to test whether there is circuit connection.

Description

technical field [0001] The invention relates to a test device and method for a computer main board, in particular to a test device and a test method for circuit connection between a CPU on a computer main board packaged with FC-LGA and a north bridge chip. Background technique [0002] With the development of science and technology, the chip packaging technology has also been developed rapidly. For example, the widely used CPU (Center Processing Unit, central processing unit) adopts FC-LGA (Flip-ChipLand Grid Array, inverted contact grid Array) package, so the CPU gets rid of the traditional pinhole connection with the CPU base, and can be directly connected to the motherboard of the computer through the CPU base by using the patch method. [0003] As shown in FIG. 1 , it is a schematic diagram of the connection between a CPU in an FC-LGA package and a computer motherboard. Comprise a north bridge chip 130 on the computer main board 100, this north bridge chip 130 is connec...

AI Technical Summary

Problems solved by technology

But if the matrix contact 112 on the CPU base 110 has deformation, bending, even this CPU base 110 and the electronic circuit on the above-mentioned motherboard 100 are welded poorly, and the electronic circuit between the CPU base 110 and the north bridge chip 130 produces a short circuit, When the circuit is open, the effective communication between the CPU 120 and the Northbridge chip 130 cannot be performed, and the computer system cannot be activated.

[0004] However, after the CPU 120 is placed on the CPU base 110, because the CPU 120 is packaged in FC-LGA, and the north bridge chip 130 adopts BGA (Ball Grid Array, ball grid array), the electronic circuit arranged in the circuit board is connected between the two. connection, so any test probes cannot be connected, therefore, it is impossible to test the possible connection fault between CPU120 and CPU base 110 through the test tool, and it is also impossible to test whether it is an effective circuit connection between the CPU120 and the North Bridge chip 130 through the test tool. do a test

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