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Flip clamping type chip packaging mechanism

A chip packaging and clamping technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problem of difficult chip replacement

Active Publication Date: 2019-03-26
CHANGZHOU COLLEGE OF INFORMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The chip is generally welded in the package structure, so it is not easy to replace the chip when there is a problem with the chip

Method used

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  • Flip clamping type chip packaging mechanism
  • Flip clamping type chip packaging mechanism
  • Flip clamping type chip packaging mechanism

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Embodiment Construction

[0019] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0020] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...

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Abstract

The invention relates to a flip clamping type chip packaging mechanism comprising a packaging box, a receiving assembly and a flipping assembly. The packaging box includes a box body and a cover body.The receiving assembly and the flipping assembly are arranged in the box body in a rotating manner and cooperate with each other to clamp a chip. The cover body is arranged at the box body in a rotating manner and seals the box body. Besides, the edge of one side of the cover body is clamped at the edge of the bottom of the box body detachably. With the mechanism, the chip is convenient to replace.

Description

technical field [0001] The invention relates to a flipping and clamping type chip packaging mechanism. Background technique [0002] With the continuous development of various industries such as aerospace, aviation, machinery, light industry, and chemical industry, electronic devices are also changing in the direction of multi-function and miniaturization. In this way, the integration level of the chip is required to be higher and higher, and the functions are more and more complex. Correspondingly, the packaging density of chips is required to be higher and higher, the number of leads is more and more, while the volume is getting smaller and lighter, and the replacement is getting faster and faster. In chip mounting, the chip is generally packaged and then fixedly installed in the electronic device. Chips are generally soldered in the packaging structure, so it is not easy to replace the chip when there is a problem with the chip. Contents of the invention [0003] Bas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/10
CPCH01L23/10
Inventor 邓志辉裴志坚邓宇翔
Owner CHANGZHOU COLLEGE OF INFORMATION TECH