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Apparatus and method for treating substrate

A technology of substrate and processing space, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., and can solve problems such as process failure and cracking of driving components

Active Publication Date: 2019-04-02
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, over a long period of time, the drive member may crack causing process failure

Method used

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  • Apparatus and method for treating substrate
  • Apparatus and method for treating substrate
  • Apparatus and method for treating substrate

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Embodiment Construction

[0045] Embodiments of the inventive concept may be modified into various forms, and the scope of the inventive concept should not be construed as being limited to the embodiments of the inventive concept described below. The embodiments of the present inventive concept are provided in order to more fully describe the present inventive concept to those skilled in the art. Therefore, the shapes and the like of components in the drawings are exaggerated to emphasize clearer description.

[0046] Below, will refer to Figure 2 to Figure 21 Embodiments of the inventive concept are described.

[0047] figure 2 is a plan view illustrating a substrate processing apparatus according to an embodiment of the inventive concept.

[0048] refer to figure 2 , the substrate processing apparatus 1 has an index module (index module) 10 and a process treating module (process treating module) 20 , and the index module 10 includes a loading port (load port) 120 and a feeding frame (feeding f...

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Abstract

Provided are an apparatus and a method for treating a substrate at a high-pressure atmosphere. The apparatus for treating the substrate includes a first body and a second body combined with each otherto define a treatment space in which the substrate is treated, a sealing member interposed between the first body and the second body to seal the treatment space from an outside at a position in which the first body is in close contact with the second body, and a driving member to drive the first body or the second body such that the treatment space is open or closed. The sealing member is positioned in a sealing groove formed in the first body. The sealing member is deformed to be in close contact with the second body by pressure of the treatment space when a process is performed. Therefore,in a process of sealing the treatment space, under the condition of not damaging the sealing member, the treatment space is sealed from the external.

Description

[0001] Cross References to Related Applications [0002] This application claims priority and benefit from Korean Patent Application No. 10-2017-0125467 filed with the Korean Industrial Property Office on September 27, 2017, the entire contents of which are incorporated herein by reference. technical field [0003] Embodiments of the inventive concept described herein relate to apparatuses and methods for processing a substrate, and more particularly, to apparatus and methods for processing a substrate under a high pressure atmosphere. Background technique [0004] To manufacture semiconductor devices, desired patterns are formed on substrates through various processes such as photolithography, etching, ashing, ion implantation, and thin film deposition. Various treatment liquids are used in the process, and impurities and particles are generated in the process. In order to remove these impurities and particles, a cleaning process for cleaning the impurities and particles i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/02101H01L21/67017H01L21/67126H01L21/67028H01L21/6719H01L21/68742H01L21/67034H01L21/67109H01L21/67051H01L21/6704H01L21/67098H01L21/02052H01L21/67393H01L21/6715H01L21/68721
Inventor 李相旼金禹永朴舟楫金鹏
Owner SEMES CO LTD