Piezoelectric element and manufacturing method thereof, shell assembly and electronic device
A piezoelectric element and housing assembly technology, applied in the field of electronics, can solve problems such as failure of piezoelectric elements and easy breakage of the first electrode, achieve stable electrical connection, improve waterproof and dustproof performance, and avoid bending. Effect
Inactive Publication Date: 2019-04-09
NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH
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- Description
- Claims
- Application Information
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Problems solved by technology
The first electrode of the existing piezoelectric element is arranged on the first surface and bent to the second surface along the side, therefore, the first electrode is prone to breakage at the bend, which leads to failure of the piezoelectric element
Method used
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Embodiment Construction
[0061] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.
[0062] see figure 1 , The piezoelectric element 20 according to the embodiment of the present invention includes a piezoelectric layer 21 , a conductive element 22 , a first electrode 23 , a second electrode 24 and a connection electrode 25 . The piezoelectric layer 21 includes a first surface 212 and a second surface 214 opposite to each other. The piezoelectric layer 21 defines a via hole 216 penetrating through the first surface 212 and the second surface 214 . The conductive element 22 is plated within the via 216 . The fir...
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The piezoelectric element disclosed by the invention comprises a piezoelectric layer, a conductive element plated in a via hole, a first electrode, a second electrode and a connecting electrode. The piezoelectric layer comprises a first surface and a second surface which are opposite to each other. The piezoelectric layer is provided with a via hole penetrating through the first surface and the second surface. The first electrode is disposed on the first surface and is electrically connected to the conductive element. The second electrode is disposed on the second surface. The connecting electrode is arranged on the second surface and is electrically connected with the conductive element, and the connecting electrode and the second electrode are mutually spaced. The piezoelectric element is provided with a through hole penetrating through a first surface and a second surface in a piezoelectric layer; The connecting electrode is arranged on the second surface, and the conductive elementis arranged in the through hole and electrically connected with the first electrode and the connecting electrode, so that when the first electrode is bent to the second surface from the side surface,the first electrode is prevented from being broken at the bent part, and the first electrode and the connecting electrode are electrically connected more stably. The invention further discloses a manufacturing method of the piezoelectric element, a shell assembly and an electronic device.
Description
technical field [0001] The invention relates to the field of electronic technology, in particular to a piezoelectric element, a manufacturing method thereof, a shell assembly and an electronic device. Background technique [0002] The piezoelectric element includes a first surface, a second surface and a side surface. The first surface and the second surface are located on opposite sides of the piezoelectric element. connect. In the existing piezoelectric element, the first electrode is arranged on the first surface and is bent to the second surface along the side. Therefore, the first electrode is prone to breakage at the bending position, thereby causing the piezoelectric element to fail. Contents of the invention [0003] Embodiments of the present invention provide a piezoelectric element, a manufacturing method of the piezoelectric element, a shell assembly and an electronic device. [0004] The piezoelectric element of the embodiment of the present invention includ...
Claims
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IPC IPC(8): G06F3/043G06F3/041G06F1/16H04M1/02
CPCG06F3/0436G06F1/1643G06F1/1656G06F3/0414G06F2203/04103H04M1/026
Inventor 夏栋郑刚强
Owner NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH