Plating-free terminal electrode silver paste for inductor

A terminal electrode, silver paste technology, applied in transformer/inductor coil/winding/connection, conductive materials dispersed in non-conductive inorganic materials, etc., can solve problems such as pollution, achieve high electrode activity, good appearance quality, Good adhesion effect

Active Publication Date: 2019-04-12
肇庆市辰业电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the molding of inductance products, most of the terminal electrodes after burning are still using electroplating process. Due to the pollution of nickel to the environment, the electroplating process has great environmental protection drawbacks, and electroplating production has been overwhelmingly popular in China. Banned in most areas

Method used

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  • Plating-free terminal electrode silver paste for inductor
  • Plating-free terminal electrode silver paste for inductor
  • Plating-free terminal electrode silver paste for inductor

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Embodiment Construction

[0008] The gist of the present invention is to use spherical silver with extremely high sphericity to match flake silver powder, dope a certain proportion of nano-silver oxide powder, use borosilicate glass powder and other inorganic additive materials, and a reasonable ratio of organic carrier to select a suitable Particle size, to obtain terminal electrode silver paste with good appearance quality, excellent electrical performance, no plating and environmental protection. The inductance products produced by using the terminal electrode silver paste meet the jumper requirements in the SMT packaging process. The electroplating-free terminal electrode silver paste for inductors of the present invention: 1. The self-developed organic carrier is used to provide the paste with good rheological properties and a strong drying strength; 2. The electrode paste is made by our company The combination of spherical silver powder and flake silver powder is developed to provide a good thixo...

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Abstract

The invention relates to the technical field of the electronic material for the electronic component, and especially relates to plating-free terminal electrode silver paste for an inductor. The plating-free terminal electrode silver paste is prepared from the following raw materials in weight percent: 25%-35% of spherical silver powder, 15%-25% of silver flake, 10%-15% of silver oxide powder, 2%-4% of glass powder and 2%-4% of other inorganic material, and 20%-25% of organic carrier, the sum of the weight percent of various substance is 100%. The plating-free terminal electrode silver paste for the inductor is large in drying strength, good in blocking appearance quality, and the sintered electrode layer is compact, the tip adhesive force is high, the SMT package requirement is satisfied,the plate skipping is avoided, the resistivity is low, the DC resistance RDC is small, the electrode silver paste is environment-friendly and plating-free, and the environment can be protected.

Description

technical field [0001] The invention relates to the technical field of electronic materials for electronic components, in particular to a silver paste for an electroplating-free terminal electrode for an inductor and a preparation method thereof. Background technique [0002] With the rapid development of electronic information industries such as mobile phones and computers, the domestic electronic components market has ushered in new opportunities for rapid development. In terms of laminated inductive components, with the increasingly mature production technology of domestic manufacturers, nearly 50 % of the inductance products are already made in China, and Sunlord and Fenghua are increasingly becoming the world's leading companies in the production and quality of inductance. In the molding of inductance products, most of the terminal electrodes after burning are still using electroplating process. Due to the pollution of nickel to the environment, the electroplating proce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B1/16H01F27/29
CPCH01B1/16H01B1/22H01F27/29
Inventor 张韶鸽杨玉华
Owner 肇庆市辰业电子有限公司
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