Display panel as well as preparation method and preparation equipment of display panel

A technology for display panels and equipment, applied in the fields of semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as the fracture of encapsulated inorganic layers, the reduction of flexible OLED display panels, the infiltration of oxygen and water vapor, and the prevention of black spots. , Improve strength and encapsulation effect, reduce the effect of oxygen and water vapor penetration

Active Publication Date: 2019-04-23
YUNGU GUAN TECH CO LTD
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Problems solved by technology

[0003] In view of this, the embodiments of the present invention provide a display panel, a method for preparing a display panel, and a preparation device, which solve the problem that the packaging film layer density of the flexible display device is too high, which may easily cause the packaging inorganic layer to break during the bending process, and the packaging film If the layer density is too low, oxygen and water vapor will penetrate into the interior of the flexible OLED display panel and reduce the service life of the flexible display panel.

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  • Display panel as well as preparation method and preparation equipment of display panel
  • Display panel as well as preparation method and preparation equipment of display panel
  • Display panel as well as preparation method and preparation equipment of display panel

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0028] figure 1 Shown is a schematic structural diagram of an inorganic layer provided by an embodiment of the present invention.

[0029] Such as figure 1 As shown, the display panel includes an encapsulation structure, and the encapsulation structure includes an inorganic layer, wherein the inorganic layer includes at least one high-density region 1 and at least one low-density region 2 . The high-density region 1 is a region with a higher density...

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Abstract

The embodiment of the invention provides a display panel, as well as the preparation method and the preparation equipment of the display panel. The invention solves the following problems in the priorart that: a packaging film layer of a flexible display device is too high in density and easily causes the fracture of a packaging inorganic layer in the bending process, the packaging film layer istoo low in density and causes the oxygen and the water vapor to permeate into a flexible OLED display panel, so that the service life of the flexible display panel is shortened. The display panel comprises a packaging structure and a water and oxygen barrier layer in the packaging structure. The water and oxygen barrier layer comprises at least one inorganic material layer. The inorganic materiallayer comprises at least one high-density region and at least one low-density region. The high-density region and the low-density region are arranged at intervals.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display panel, a method for preparing the display panel, and a preparation device. Background technique [0002] With the continuous development of display technology, the manufacturing technology of flexible OLED (Organic Light-Emitting Diode, organic light-emitting diode) display panel is also becoming mature. The Plasma (plasma) generated by PECVD (PlasmaEnhanced Chemical Vapor Deposition, chemical vapor deposition) of the traditional flexible OLED display panel reaches the substrate as a whole to form a uniform film layer. However, in the TFE (Thin-Film Encapsulation, thin film encapsulation) of flexible display panels, due to the problem of stress matching, if the encapsulation film layer density is too high, it is easy to cause the TFE inorganic layer to break during the bending process, thereby making the encapsulation effect decline. However, since the flexible OLED ...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L51/52H01L51/56
CPCH10K59/126H10K50/8426H10K71/00
Inventor 许嵩
Owner YUNGU GUAN TECH CO LTD
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