Display panel, manufacturing method and manufacturing equipment of display panel

A display panel and directional line technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as oxygen and water vapor infiltration, packaging inorganic layer fracture, and flexible OLED display panel reduction

Active Publication Date: 2021-04-20
YUNGU GUAN TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the embodiments of the present invention provide a display panel, a method for preparing a display panel, and a preparation device, which solve the problem that the packaging film layer density of the flexible display device is too high, which may easily cause the packaging inorganic layer to break during the bending process, and the packaging film If the layer density is too low, oxygen and water vapor will penetrate into the interior of the flexible OLED display panel and reduce the service life of the flexible display panel.

Method used

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  • Display panel, manufacturing method and manufacturing equipment of display panel
  • Display panel, manufacturing method and manufacturing equipment of display panel
  • Display panel, manufacturing method and manufacturing equipment of display panel

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0028] figure 1 Shown is a schematic structural diagram of an inorganic layer provided by an embodiment of the present invention.

[0029] Such as figure 1 As shown, the display panel includes an encapsulation structure, and the encapsulation structure includes an inorganic layer, wherein the inorganic layer includes at least one high-density region 1 and at least one low-density region 2 . The high-density region 1 is a region with a higher density...

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Abstract

The embodiments of the present invention provide a display panel, a method for preparing a display panel, and a preparation device, which solve the problem that the density of the packaging film layer of a flexible display device is too high, which may cause the packaging inorganic layer to break during the bending process, and the density of the packaging film layer is too low Oxygen and water vapor will infiltrate into the interior of the flexible OLED display panel and reduce the service life of the flexible display panel. Comprising: an encapsulation structure and a water-oxygen barrier layer in the encapsulation structure, wherein the water-oxygen barrier layer includes at least one inorganic material layer; wherein the inorganic material layer includes at least one high-density region and at least one low-density region , and the high-density area and the low-density area are arranged at intervals.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display panel, a method for preparing the display panel, and a preparation device. Background technique [0002] With the continuous development of display technology, the manufacturing technology of flexible OLED (Organic Light-Emitting Diode, organic light-emitting diode) display panel is also becoming mature. The Plasma (plasma) generated by PECVD (PlasmaEnhanced Chemical Vapor Deposition, chemical vapor deposition) of the traditional flexible OLED display panel reaches the substrate as a whole to form a uniform film layer. However, in the TFE (Thin-Film Encapsulation, thin film encapsulation) of flexible display panels, due to the problem of stress matching, if the encapsulation film layer density is too high, it is easy to cause the TFE inorganic layer to break during the bending process, thereby making the encapsulation effect decline. However, since the flexible OLED ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/32H01L51/52H01L51/56
CPCH10K59/126H10K50/8426H10K71/00
Inventor 许嵩
Owner YUNGU GUAN TECH CO LTD
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