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Chip packing device

A chip packaging and welding device technology, applied in auxiliary devices, soldering irons, electrical components, etc., can solve the problems of degraded product qualification rate, long welding time, and inability to control the welding time range, so as to improve product qualification rate, Prevents the effect of long welding time

Active Publication Date: 2019-08-23
深圳市创心宏艺科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The welding time of each solder spot should not exceed 3 seconds during welding. Due to manual packaging, it may not be possible to control the welding time range during welding, especially for novices, it is easy to happen that the welding time is too long, and the pass rate of the product is downgraded.

Method used

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.

[0030] see Figure 1-9 , the present invention provides a chip packaging device technical solution: its structure includes a base 1, a welding device 2, a heater 3, a display screen 4, a camera 5, a lighting lamp 6, and a workbench 7, and the base 1 is equipped with a working A platform 7, a welding device 2 is arranged above the workbench 7, and the welding device 2 is electrically connected to the heater 3 arranged on the side of the base 1. The camera 5 is arranged above the workbench 7, and the camera 5 and the The display screen 4 is connected, the display screen 4 is installed on the base 1, the illuminating lamp 6 is arranged on the side of the workbench 7 and is installed on the base 1, the welding device 2 includes an electric soldering iron a, a moving device b, a gu...

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PUM

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Abstract

The invention discloses a chip packing device. The chip packing device structurally comprises a base, a welding device, a heater, a display screen, a camera, a lighting lamp, and a workbench, the workbench is mounted on the base, the welding device is arranged at the upper portion of the workbench, the welding device is electrically connected with the heater arranged on the side surface of the base, the camera is arranged at the upper portion of the workbench, the camera is connected with the display screen, the display screen is mounted on the base, the lighting lamp is arranged on the side surface of the workbench and mounted on the base, the welding device comprises electric soldering iron, a moving device, a guiding device, a fixed-point device, an electromagnetic device, a delaying mechanism, and a shell, and the top of the electric soldering iron is arranged in the shell. The chip packing device has the beneficial effects that the delaying device can be started during initial welding, the electric soldering iron is driven to be contracted within three seconds so that welding is stopped, the problem that the time cannot be accurately estimated manually is avoided accordingly,the long welding time is prevented, and the product pass rate is increased.

Description

technical field [0001] The invention relates to the field of chips, in particular to a chip packaging device. Background technique [0002] At present, some large domestic enterprises have begun to use imported equipment for processing, but most enterprises are still using manual operations for production. In view of this situation, in order to reduce the labor cost of enterprises, improve production efficiency, and improve product qualification rate, And developed a manual packaging machine. [0003] The welding time of each solder joint should not exceed 3 seconds during welding. Due to manual packaging, it may not be possible to control the welding time range during welding. Especially for novices, it is easy to happen that the welding time is too long, and the pass rate of the product will be downgraded. Contents of the invention [0004] The main purpose of the present invention is to overcome the deficiencies of the prior art and provide a chip packaging device. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/03B23K3/08H01L21/67B23K101/36
CPCB23K3/03B23K3/08B23K2101/36H01L21/67121
Inventor 王淑琴
Owner 深圳市创心宏艺科技有限公司