A copper clad board

Abstract

The present invention relates to the technical field of the electronic industry, specifically a copper clad laminate, including an upper copper foil, a lower copper foil and an adhesive tape layer for fixing the upper copper foil and the lower copper foil. The present invention also includes a rubber block, the rubber The blocks are evenly distributed on both sides of the drilled hole; the rubber block has a first cavity and a second cavity, both of which are ring-shaped; the first cavity has a spherical heat conduction plate passing through and is filled with PVDF material Powder; the second cavity includes an air bag, a spout, a pipeline, a chute, an impeller, and a flammable film, and is equipped with dry powder; the air bags are connected with a catheter, and a one-way valve is fixedly connected to the catheter; the upper Both the lower surface of the copper foil and the upper surface of the lower copper foil are provided with a groove, and mercury thiocyanide powder is placed in the groove, which is sealed by a flammable film; the invention can automatically clamp the wire during spot welding; Automatic fire extinguishing in case of fire to protect equipment safety; easy to use and strong practicability.

Description

technical field [0001] The invention relates to the technical field of the electronic industry, in particular to a copper clad laminate. Background technique [0002] Copper-clad laminate ----- also known as base material, is a sheet-like material made by impregnating the reinforcing material with resin, covering one or both sides with copper foil, and hot pressing, called copper-clad laminate. It is the basic material for PCB, often called the substrate, and when it is used in the production of multi-layer boards, it is also called the core board (CORE). Copper-clad laminates are mainly composed of three parts: substrate, copper foil, and copper-clad laminate adhesive. Among them: insulating laminates composed of polymer synthetic resins and reinforcing materials can be used as substrates for copper-clad laminates. There are many types of synthetic resins, and phenolic resins are commonly used. Resin, epoxy resin, polytetrafluoroethylene, etc. Reinforcement materials gener...

AI Technical Summary

Problems solved by technology

[0004] Although copper clad laminate technology has been developing continuously as an important basic raw material for the electronics industry, there are still inconveniences in its use.

During the spot welding operation, the operator needs to perform the spot welding operation with one hand and hold the wire with the other hand, which is not only inconvenient to operate, but also requires the operator's attention and is prone to mistakes; Due to the high temperature generated by long-term work or the short circuit of electrical components, a fire occurs. Once the copper clad laminate catches fire, it is easy to ignite other electronic components, causing a fire and endangering safety.

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