Laser cutting device for noninvasive OLED glass substrate

Abstract

The invention relates to the technical field of OLED panel processing, and discloses a laser cutting device for a noninvasive OLED glass substrate. The device comprises a stand, a vacuum adsorption type workbench for storing the glass substrate is arranged at the upper end of the stand, a cutting assembly is arranged on one side of the upper portion of the stand, the cutting assembly comprises a glass cutter used for conducting primary collision on the glass substrate and a laser lens used for cutting the glass substrate, the cutting assembly is fixed to the upper end of a first X-axis linearmodule, the first X-axis linear module drives the cutting assembly to penetrate through the lower portion of the vacuum adsorption type workbench, a breaking assembly is further arranged above the vacuum adsorption type workbench, the breaking assembly comprises a breaking knife arranged in a lifting mode, and the breaking knife is used for separating the cut glass substrate. The glass cutter andthe linear CO2 laser are combined to guide crack type scribing of the glass, and the breaking cutter is matched, so the cutting speed is high, and trimming is not needed after processing is completed.

Description

technical field [0001] The invention relates to the technical field of OLED panel processing, in particular to a laser cutting device for a non-invasive OLED glass substrate. Background technique [0002] In recent years, through its increasingly mature production technology, OLED display screens have successively landed in various mobile phone markets. Because of its high luminous efficiency, short response time, high definition and contrast, nearly 180° viewing angle, wide operating temperature range, flexible display and wide color gamut full-color display, etc., it has occupied the middle and high-end mobile phones of major brands. The display panel market of mobile phone models will have a broader application market in the future. [0003] In the production process of OLED displays for mobile phones, according to the current production process of the factory, the cutting of the glass substrate is an essential process. At present, the production line of the mainstream ...

AI Technical Summary

Problems solved by technology

The cutting pressure and depth of the traditional glass knife are not easy to adjust, the compressive strength of the cut glass is not high, the breakage rate is high, and a large number of glass particles are produced; while the water jet cutting has a low processing speed, a large cutting width, and low precision. Water is also not suitable for cutting OLED glass substrate cutting

The more advanced one is to use laser cutting. In laser cutting, if the high-power multi-photon cutting method is used, the cutting effect is relatively better, but high-power laser equipment is expensive, and it is difficult to control multi-photon cutting when cutting large-size glass.

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