Interconnect Substrates for Computing Devices and Fast Peripheral Components
A technology for interconnecting substrates and computing devices, applied in computing, electrical components, support structure installation, etc., can solve problems such as increasing the complexity of GPU systems and compromising the integrity of components
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0100] Hereinafter, the embodiments are described in detail in conjunction with the accompanying drawings, wherein the same reference numerals are used in the attached drawings to indicate similar or identical elements. The drawings are not drawn to scale and serve only to illustrate the invention. Several aspects of the invention are described below with reference to illustrative embodiments. It should be understood that numerous specific details, relationships and methods are provided in order to provide a complete understanding of the invention. However, it will be understood by those skilled in the art that the present invention may be practiced without one or more of the specific details, or in other ways. In some instances, well-known structures or operations are not shown in detail to avoid obscuring the invention. The invention is not limited by the illustrated ordering of acts or events, as some acts may occur in different orders and / or concurrently with other acts ...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


