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Laminar flow device

A glyph and body technology, applied in the field of laminar flow devices, can solve the problems of wafer 70 surface contamination damage, affecting quality and yield, etc.

Inactive Publication Date: 2020-04-21
NAT TAIPEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

like figure 1 As shown, the aforementioned FOUP 7 is usually stored in a process environment. When the wafer 70 in the box body 7 needs to be taken out and the opening 72 of the FOUP 7 is opened, the cleanliness level in the process environment is relatively low. Low pollutants 80 will invade the FOUP 7 along with the drainage, causing contamination and damage to the surface of the wafer 70 and affecting its quality and yield

Method used

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Embodiment Construction

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0038] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). For positional relationship, movement situation, etc., if the specific posture changes, the directional indication will also change accordingly.

[0039] In the present inventio...

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Abstract

The present invention discloses a laminar flow device comprising a U-shaped structure, a side cover, an upper cover, at least one air inlet, and at least one ventilation board. The U-shaped structureis composed of three planer boards. The side cover is disposed at the opening of the U-shaped structure, and combined with the U-shaped structure to form a main body which is open above and below. Theupper cover is disposed above the main body. The at least one air inlet is disposed on the main body for feeding a clean gas. The at least one ventilation board including a plurality of ventilation holes for generating an even flow is disposed in the main body.

Description

technical field [0001] The present invention relates to a laminar flow device capable of generating uniform air flow, especially a laminar flow device arranged between a wafer transfer box and a process environment to prevent external pollutants from entering the wafer transfer box. Background technique [0002] In the semiconductor manufacturing process, the wafer is a high-precision semiconductor material used in the production of integrated circuits, and its surface must be kept high in cleanliness without contact with moisture, particles or other gaseous pollutants; therefore, the wafer is used in various The process equipment needs to be stored in the wafer transfer box, so that the wafers in the box will not be polluted by the aforementioned pollutants. [0003] Please refer to figure 1 , which is a schematic diagram between a known FOUP and a process environment. like figure 1 As shown, the aforementioned FOUP 7 is usually stored in a process environment. When the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677
CPCH01L21/67763H01L21/67389H01L21/67772H01L21/02057H01L21/67017H01L21/673H01L21/02082
Inventor 胡石政林廸
Owner NAT TAIPEI UNIV OF TECH