Crater detection method

Abstract

The invention relates to a crater detection method used for detecting the crater of a copper wire product and has very high monitoring frequency during product type, packaging model and production equipment replacement and parameter adjustment. The method has the advantages of repeatability, simplicity and convenience. According to the method of the invention, a mixed acid solution can be repeatedly used, and the mixed acid solution does not need to be prepared every time and can be replaced once a week; few experiment tools are needed to be adopted, probes or knives, microscopes, beakers, pure water and alcohol which are common in a bonding process are adopted; and workers in the bonding process can operate according to procedures as required.

Description

technical field [0001] The invention relates to the chip packaging industry, in particular to the detection of craters introduced into the bonding process of copper wire products. Background technique [0002] The current application hotspots of the semiconductor industry have expanded from the initial computer and communication to consumer electronics, new energy, automotive electronics and other fields. Low cost has always been the core driving factor of the packaging and testing industry downstream of the vertical division of labor. Therefore, in recent years, in addition to technological and product innovations, the semiconductor packaging industry has been constantly seeking technologies with good process performance and low price to replace gold wires, so as to reduce packaging costs and improve reliability. [0003] Because copper wire has good electrical and mechanical properties, it has won the favor of most manufacturers, and began to mass-produce copper wire and ...